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TDA1670A

STMicroelectronics

TDA1670A by STMicroelectronics

TDA1670A by STMicroelectronics is a Vertical Deflection IC with 35V power supply, 15 terminals in IN-LINE package style. It uses BIPOLAR technology and has Tin/Lead terminal finish. Ideal for vertical deflection applications in electronic devices.

Median Price

$24.000

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 225 parts In-Stock

1+ parts

$24.000

100+ parts

$21.230

1k+ parts

$19.680

10k+ parts

-

225

$24.000

$21.230

$19.680

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Vyrian

USA . 3,044 parts In-Stock

1+ parts

-

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3,044

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Anansix

USA . 2,830 parts In-Stock

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2,830

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Digiode

USA . 2,431 parts In-Stock

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2,431

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Odi Ramu Company

Canada . 2,150 parts In-Stock

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2,150

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ECAB

Sweden . 235 parts In-Stock

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235

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ACDS - Activité Composants Distribution Service

France . 225 parts In-Stock

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225

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Dan-Mar Components

USA . 225 parts In-Stock

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225

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Huijzer Components

Netherlands . 104 parts In-Stock

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104

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LittleDiode

UK . 32 parts In-Stock

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32

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R&J Components

USA . 30 parts In-Stock

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30

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Manoshevitz Elec. Sales

Israel . 25 parts In-Stock

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25

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Component Electronics Inc.

Canada . 21 parts In-Stock

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21

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PC Components Company LLC

USA . 18 parts In-Stock

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18

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Prism Electronics

USA . 15 parts In-Stock

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15

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Electronics Depot

USA . 7 parts In-Stock

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7

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GES GmbH

Germany . 7 parts In-Stock

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7

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Electronic Expediters

USA . 5 parts In-Stock

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5

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Fibra_Brandt Electronic GMBH

Germany . 3 parts In-Stock

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3

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Digital Electronic Gebert Verwaltungs UG

Germany . 2 parts In-Stock

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Quantum Digital Technology

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,021 parts In-Stock

1+ parts

$0.903

100+ parts

-

1k+ parts

$0.812

10k+ parts

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2,021

$0.903

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$0.812

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MKK Technologies

India . 1,757 parts In-Stock

1+ parts

$1.697

100+ parts

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1,757

$1.697

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DigiPath Technology Company

USA . 1,757 parts In-Stock

1+ parts

$1.697

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1,757

$1.697

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Kepictronics

USA . 4,400 parts In-Stock

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Corphita

USA . 1,325 parts In-Stock

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1,325

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Parana Technologies

USA . 988 parts In-Stock

1+ parts

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100+ parts

$1.079

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988

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$1.079

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Assy Fe

Spain . 250 parts In-Stock

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250

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Perfect Parts

USA . 149 parts In-Stock

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149

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Cyclops Electronics Ltd (Excess)

UK . 49 parts In-Stock

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49

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Overview

Experience superior quality and performance with the TDA1670A Vertical Deflection IC from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics ensures reliability and innovation in every product they offer. The TDA1670A is ideal for applications requiring vertical deflection, providing efficient power supplies and 15 terminals for seamless integration. With a durable plastic/epoxy package body and advanced bipolar technology, this IC delivers unmatched value and benefits to customers looking for top-notch performance in their electronic devices. Elevate your designs with the TDA1670A and experience the difference of cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the IC, making it durable and reliable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and provides efficient use of space.

General IC Type: VERTICAL DEFLECTION IC

Designed specifically for vertical deflection applications, ensuring optimal performance in its intended use.

Power Supplies (V): 35

Operating at 35 volts allows for compatibility with a wide range of power supplies in various electronic systems.

No. of Terminals: 15

Having 15 terminals provides flexibility in connectivity options and enables the IC to be used in diverse circuit configurations.

Package Style (Meter): IN-LINE

In-line package style facilitates easy installation and replacement of the IC in circuit designs.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish ensures good conductivity and solderability, making it easy to connect the IC to other components.

Terminal Position: ZIG-ZAG

Zig-zag terminal position enhances the stability of the connections and minimizes the risk of short circuits.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and efficient power consumption, making the IC suitable for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical support and secure connections, enhancing the overall reliability of the IC.

Terminal Pitch: 1.27 mm

Having a 1.27 mm terminal pitch allows for precise and compact placement on circuit boards, increasing design flexibility.

Technical Specifications

Vertical Deflection ICs TDA1670A attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T15

JESD-609 Code:

e0

No. of Terminals:

15

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP15,.2,.17TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA1670A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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