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TDA1170N

STMicroelectronics

TDA1170N by STMicroelectronics

TDA1170N by STMicroelectronics is a Vertical Deflection IC with 12 terminals, operating voltage range of 10-35V. It is used in TV and monitor applications, featuring bipolar technology and through-hole terminal form. The package style is in-line rectangular made of plastic/epoxy material.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

32

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 52 parts In-Stock

1+ parts

$3.850

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$2.880

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$2.500

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52

$3.850

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Digiode

USA . 3,811 parts In-Stock

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Vyrian

USA . 1,610 parts In-Stock

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1,610

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Fibra_Brandt Electronic GMBH

Germany . 1,187 parts In-Stock

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ComSIT Distribution GmbH

Germany . 868 parts In-Stock

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868

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PC Components Company LLC

USA . 425 parts In-Stock

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425

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ECAB

Sweden . 410 parts In-Stock

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Anansix

USA . 304 parts In-Stock

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Odi Ramu Company

Canada . 225 parts In-Stock

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Prism Electronics

USA . 173 parts In-Stock

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Quantum Digital Technology

USA . 105 parts In-Stock

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105

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Huijzer Components

Netherlands . 100 parts In-Stock

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R&J Components

USA . 80 parts In-Stock

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80

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Carlin Systems, Inc.

USA . 50 parts In-Stock

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50

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LittleDiode

UK . 43 parts In-Stock

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43

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Corel Iberica Componentes, S.L.

Spain . 38 parts In-Stock

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J2 Sourcing AB

Sweden . 35 parts In-Stock

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35

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GES GmbH

Germany . 25 parts In-Stock

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25

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Atlantic Semiconductor

USA . 25 parts In-Stock

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25

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Microfarads

USA . 24 parts In-Stock

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24

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Odyssey Electronics LTD

USA . 24 parts In-Stock

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24

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Manoshevitz Elec. Sales

Israel . 19 parts In-Stock

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Vectronix, Inc

USA . 14 parts In-Stock

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14

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MRC Electronics

USA . 10 parts In-Stock

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10

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MISTER SPROCKETS

USA . 10 parts In-Stock

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10

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Electronics Depot

USA . 7 parts In-Stock

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7

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Donberg Electronics Ltd

Ireland . 6 parts In-Stock

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6

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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EMSNET

USA . 4 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 2 parts In-Stock

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Goldney Electronics S.L.

Spain . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,289 parts In-Stock

1+ parts

$1.819

100+ parts

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1k+ parts

$1.637

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1,289

$1.819

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$1.637

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MKK Technologies

India . 1,752 parts In-Stock

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$3.420

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1,752

$3.420

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DigiPath Technology Company

USA . 1,752 parts In-Stock

1+ parts

$3.420

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1,752

$3.420

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A-Z Elektronik GmbH

Germany . 4,620 parts In-Stock

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4,620

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 2,283 parts In-Stock

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$2.175

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$2.175

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Corphita

USA . 1,862 parts In-Stock

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1,862

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Perfect Parts

USA . 587 parts In-Stock

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587

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Cyclops Electronics Ltd (Excess)

UK . 155 parts In-Stock

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155

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Glotronic Ltd.

UK . 120 parts In-Stock

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120

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Assy Fe

Spain . 49 parts In-Stock

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49

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Schahn Electronic Components

Germany . 21 parts In-Stock

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Overview

Transform your viewing experience with the TDA1170N Vertical Deflection IC from STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics delivers cutting-edge technology that ensures optimal performance in TV and monitor applications. With a power supply range of 10V to 35V, this IC offers unmatched value by providing clear and crisp images while maintaining energy efficiency. Upgrade your electronics with the TDA1170N and enjoy a new level of visual excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Enhances durability and reliability of the product.

Package Shape: RECTANGULAR

Facilitates easy installation and compatibility with standard equipment.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications, ensuring optimal performance.

Power Supplies (V): 25

Operates efficiently with a power supply of 25V, suitable for various TV and monitor models.

No. of Terminals: 12

Provides sufficient connectivity options for the intended application.

Package Style (Meter): IN-LINE

Simplifies the layout design and allows for compact placement within devices.

Application: TV; MONITOR

Versatile usage in TV and monitor devices.

Terminal Finish: TIN LEAD

Ensures proper conductivity and connection stability.

Terminal Position: QUAD

Facilitates secure mounting and connection arrangement.

Minimum Supply Voltage (Vsup): 10 V

Allows for operation at low voltage levels, conserving power.

Technology: BIPOLAR

Utilizes bipolar technology for efficient performance and accuracy.

Terminal Form: THROUGH-HOLE

Enables easy soldering and secure attachment to circuit boards.

Terminal Pitch: 2.54 mm

Standard terminal pitch for compatibility with various board layouts.

Maximum Supply Voltage (Vsup): 35 V

Supports a higher voltage range for flexibility in power supply options.

Technical Specifications

Vertical Deflection ICs TDA1170N attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PQIP-T12

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

12

Package Body Material:

PLASTIC/EPOXY

Package Code:

QIP

Package Equivalence Code:

QI16B,.2/.4,100TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

25

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

QUAD

Trade Compliance

TDA1170N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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