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TDA9302H

STMicroelectronics

TDA9302H by STMicroelectronics

TDA9302H by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates with a power supply range of 15-35V, features 7 terminals in a flange mount package, and utilizes bipolar technology for efficient performance.

Median Price

$4.592

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 62 parts In-Stock

1+ parts

$4.592

100+ parts

$4.822

1k+ parts

$4.546

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62

$4.592

$4.822

$4.546

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Lantek

USA . 5,000 parts In-Stock

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Digiode

USA . 4,683 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 3,700 parts In-Stock

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3,700

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Vyrian

USA . 2,092 parts In-Stock

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2,092

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Anansix

USA . 827 parts In-Stock

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4 Star Electronics, Inc.

USA . 630 parts In-Stock

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630

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Q Components

USA . 198 parts In-Stock

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198

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Component Electronics Inc.

Canada . 107 parts In-Stock

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107

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R&J Components

USA . 90 parts In-Stock

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90

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Prism Electronics

USA . 53 parts In-Stock

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53

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Odyssey Electronics LTD

USA . 44 parts In-Stock

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Huijzer Components

Netherlands . 37 parts In-Stock

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Legend Electronics Inc.

USA . 16 parts In-Stock

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16

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LittleDiode

UK . 12 parts In-Stock

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12

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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8

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ECAB

Sweden . 5 parts In-Stock

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5

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EMSNET

USA . 5 parts In-Stock

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5

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Donberg Electronics Ltd

Ireland . 3 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,499 parts In-Stock

1+ parts

$3.221

100+ parts

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1k+ parts

$2.899

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1,499

$3.221

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$2.899

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MKK Technologies

India . 2,121 parts In-Stock

1+ parts

$6.057

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2,121

$6.057

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DigiPath Technology Company

USA . 2,121 parts In-Stock

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$6.057

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2,121

$6.057

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GreenTree Electronics

Israel . 46,034 parts In-Stock

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46,034

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Kepictronics

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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2,700

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Corphita

USA . 1,425 parts In-Stock

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Authorized Procurement Solutions

USA . 1,190 parts In-Stock

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Perfect Parts

USA . 83 parts In-Stock

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83

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Parana Technologies

USA . 58 parts In-Stock

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$3.851

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58

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$3.851

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Assy Fe

Spain . 19 parts In-Stock

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Overview

Elevate your display technology with the TDA9302H from STMicroelectronics, a leader in innovative components. This high-quality Vertical Deflection IC ensures superior performance for TVs and monitors, providing sharp, reliable visuals that enhance user experiences. With its robust design and easy integration, the TDA9302H delivers exceptional value, making it the ideal choice for manufacturers seeking efficiency and longevity in their products. Transform your displays today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and resistance to environmental factors, making this IC suitable for prolonged use in televisions and monitors.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space and allows for efficient integration into various circuit designs.

General IC Type: VERTICAL DEFLECTION IC

As a vertical deflection IC, this product is specifically designed to handle vertical scan control, ensuring high-quality image display in TVs and monitors.

Power Supplies (V): 35

With a maximum power supply of 35V, this IC can accommodate a wide range of applications, providing flexibility in design and performance.

No. of Terminals: 7

Having 7 terminals allows for straightforward connectivity, enhancing ease of installation and integration into various electronic systems.

Package Style (Meter): FLANGE MOUNT

The flange mount style offers secure installation options, ensuring reliability and stability in the application.

Application: TV; MONITOR

Designed specifically for TVs and monitors, this IC provides optimized operation for display devices, ensuring compatibility and high performance.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures strong solder joints and enhances the longevity of the electrical connections in demanding operating environments.

Terminal Position: ZIG-ZAG

The zig-zag terminal position enables efficient layout on the PCB, facilitating better space utilization and improved thermal performance.

Minimum Supply Voltage (Vsup): 15 V

A minimum supply voltage of 15V allows the IC to function effectively in lower power applications while still delivering solid performance.

Technology: BIPOLAR

Utilizing bipolar technology enhances the performance characteristics, including speed and power efficiency, crucial for high-quality image processing.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures robust mechanical stability and ease of soldering, making it ideal for prototyping and production.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, the IC allows for compact designs and compatibility with various PCBs without sacrificing performance.

Maximum Supply Voltage (Vsup): 30 V

A maximum supply voltage of 30V ensures the IC can handle demanding applications while providing over-voltage protection for longevity.

Technical Specifications

Vertical Deflection ICs TDA9302H attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA9302H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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