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TDA9302

STMicroelectronics

TDA9302 by STMicroelectronics

TDA9302 by STMicroelectronics is a Vertical Deflection IC with 8 terminals in a rectangular package. It operates at 10-35V, suitable for TV applications. The IC's flange mount style and through-hole terminal form make it easy to integrate into TV circuitry.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,477

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-

-

Anansix

USA . 2,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,887

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Digiode

USA . 2,208 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,208

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,163 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

$1.138

10k+ parts

-

1,163

$1.264

-

$1.138

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MKK Technologies

India . 1,179 parts In-Stock

1+ parts

$2.377

100+ parts

-

1k+ parts

-

10k+ parts

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1,179

$2.377

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DigiPath Technology Company

USA . 1,179 parts In-Stock

1+ parts

$2.377

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

$2.377

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-

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Parana Technologies

USA . 1,682 parts In-Stock

1+ parts

-

100+ parts

$1.511

1k+ parts

-

10k+ parts

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1,682

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$1.511

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Corphita

USA . 502 parts In-Stock

1+ parts

-

100+ parts

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502

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Overview

Unlock the potential of your TV with the TDA9302 Vertical Deflection IC by STMicroelectronics. Known for their high-quality manufacturing, STMicroelectronics delivers reliable and durable products that exceed industry standards. The TDA9302 is ideal for applications in TVs, providing smooth and precise vertical deflection for an enhanced viewing experience. With its advanced technology and dependable performance, this IC offers exceptional value and benefits to customers looking to elevate their TV performance. Trust STMicroelectronics to deliver excellence in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making the product suitable for use in various applications without adding unnecessary weight.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into electronic devices and circuit layouts, maximizing space efficiency.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection, ensuring optimal performance and reliability in TV applications.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for different components and allows for flexible circuit design.

Package Style (Meter): FLANGE MOUNT

The flange mount style enables secure installation onto circuit boards or mounting surfaces, ensuring stability and reliability in operation.

Application: TV

Tailored for TV applications, guaranteeing compatibility and optimal functionality when used in television circuits.

Minimum Supply Voltage (Vsup): 10 V

A low minimum supply voltage of 10V allows for efficient power consumption and operation, contributing to energy efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during installation, enhancing the product's reliability in circuit assemblies.

Maximum Supply Voltage (Vsup): 35 V

With a maximum supply voltage of 35V, the product can handle higher voltage inputs, offering flexibility and compatibility with various power sources.

Technical Specifications

Vertical Deflection ICs TDA9302 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PSFM-T8

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

TDA9302 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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