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TDA4856

NXP Semiconductors

TDA4856 by NXP Semiconductors

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR;

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Lifecycle Status

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14

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Digiode

USA . 2,153 parts In-Stock

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Vyrian

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Huijzer Components

Netherlands . 230 parts In-Stock

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Fibra_Brandt Electronic GMBH

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J2 Sourcing AB

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ComSIT Distribution GmbH

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Prism Electronics

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Cyclops Electronics Ltd

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Component Electronics Inc.

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Odyssey Electronics LTD

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LittleDiode

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One Stop Electronics

USA . 417 parts In-Stock

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Technical Specifications

Vertical Deflection ICs TDA4856 attributes and parameters. Explore more Vertical Deflection ICs devices from NXP Semiconductors

Specs

Application:

MONITOR

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T32

Length:

28.95 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

9.2 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10.16 mm

Trade Compliance

TDA4856 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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