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STV9303W

STMicroelectronics

STV9303W by STMicroelectronics

STV9303W by STMicroelectronics is a vertical deflection IC designed for TV applications. It operates at a max supply voltage of 35V, features 11 terminals in a zig-zag position, and comes in a rectangular plastic/epoxy package. Ideal for enhancing display performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,024 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,024

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-

-

-

Vyrian

USA . 1,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,025

-

-

-

-

Anansix

USA . 986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

986

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,083 parts In-Stock

1+ parts

$3.166

100+ parts

-

1k+ parts

$2.849

10k+ parts

-

2,083

$3.166

-

$2.849

-

MKK Technologies

India . 1,088 parts In-Stock

1+ parts

$5.953

100+ parts

-

1k+ parts

-

10k+ parts

-

1,088

$5.953

-

-

-

DigiPath Technology Company

USA . 1,088 parts In-Stock

1+ parts

$5.953

100+ parts

-

1k+ parts

-

10k+ parts

-

1,088

$5.953

-

-

-

Corphita

USA . 4,248 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,248

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-

-

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Parana Technologies

USA . 2,263 parts In-Stock

1+ parts

-

100+ parts

$3.785

1k+ parts

-

10k+ parts

-

2,263

-

$3.785

-

-

Overview

Elevate your TV designs with the STV9303W from STMicroelectronics, a trusted leader in innovative solutions. This premium vertical deflection IC delivers exceptional performance and reliability, ensuring crisp visuals and superior viewing experiences. With its robust design tailored for optimal functionality, the STV9303W is perfect for enhancing consumer electronics. Unlock greater value and elevate your projects with this essential component that combines quality, innovation, and efficiency seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures robust construction, making it suitable for various environmental conditions while providing good insulation.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on the PCB, making it compatible with a variety of layout designs.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection in display applications, ensuring optimized performance in television systems.

Power Supplies (V): 35

Support for up to 35V power supply makes this IC suitable for high-performance applications requiring stable operation under load.

No. of Terminals: 11

With 11 terminals, this IC provides ample connectivity options for versatile integration into various circuits.

Package Style (Meter): IN-LINE

In-line packaging style is ideal for automated assembly processes, enhancing production efficiency.

Application: TV

Designed specifically for TV applications, this IC ensures enhanced performance and reliability in display technologies.

Terminal Finish: TIN LEAD

Tin-lead terminal finish offers excellent solderability, ensuring secure connections and longevity in circuit designs.

Terminal Position: ZIG-ZAG

The zig-zag terminal positioning facilitates easier handling and installation onto PCB, improving assembly efficiency.

Terminal Form: THROUGH-HOLE

Through-hole design provides strong mechanical support and electrical connectivity, making it ideal for high-reliability circuits.

Terminal Pitch: 1.7 mm

A terminal pitch of 1.7 mm allows for compact assembly while maintaining adequate spacing for soldering, making it versatile for different layouts.

Maximum Supply Voltage (Vsup): 35 V

Capability to handle up to 35 V maximizes its utility in high-voltage applications, providing flexibility in design choices.

Technical Specifications

Vertical Deflection ICs STV9303W attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZIP-T11

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

11

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP11,.1,.1,67

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

35 V

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

STV9303W General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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