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STV9325

STMicroelectronics

STV9325 by STMicroelectronics

STV9325 by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates with a supply voltage range of 10-35 V, features 7 terminals in a flange mount package, and utilizes bipolar technology. Ideal for enhancing display performance in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,292 parts In-Stock

1+ parts

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2,292

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Digiode

USA . 1,298 parts In-Stock

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1,298

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Vyrian

USA . 1,288 parts In-Stock

1+ parts

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1,288

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Cyclops Electronics Ltd

UK . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,674 parts In-Stock

1+ parts

$1.524

100+ parts

-

1k+ parts

$1.371

10k+ parts

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1,674

$1.524

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$1.371

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MKK Technologies

India . 105 parts In-Stock

1+ parts

$2.865

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105

$2.865

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DigiPath Technology Company

USA . 105 parts In-Stock

1+ parts

$2.865

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105

$2.865

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Kepictronics

USA . 12,496 parts In-Stock

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12,496

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A-Z Elektronik GmbH

Germany . 5,207 parts In-Stock

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5,207

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Parana Technologies

USA . 2,094 parts In-Stock

1+ parts

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100+ parts

$1.822

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2,094

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$1.822

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Corphita

USA . 73 parts In-Stock

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73

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Overview

Elevate your display technology with the STV9325 from STMicroelectronics, a leader in innovative semiconductor solutions. This vertical deflection IC ensures exceptional performance and reliability for TVs and monitors, delivering vibrant visuals and seamless operation. Designed with quality in mind, it provides unmatched efficiency and durability, making it an ideal choice for manufacturers seeking to enhance their products while reducing costs. Experience the advantages of superior engineering and trust STMicroelectronics for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY ensures durability and resistance to environmental factors, making this IC suitable for long-term use in televisions and monitors.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization in PCB designs, facilitating compact layouts in consumer electronics.

General IC Type: VERTICAL DEFLECTION IC

As a vertical deflection IC, it is specifically designed for applications in TV and monitor display systems, ensuring optimized performance in image rendering.

Power Supplies (V): 34

A power supply rating of 34V indicates robustness in handling a wide input range, ensuring compatibility with various circuit designs.

No. of Terminals: 7

Having 7 terminals offers flexibility in circuit integration, simplifying connections while supporting various functionality requirements.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides a secure and stable mounting option, increasing mechanical integrity in the final assembly.

Application: TV; MONITOR

Designed specifically for TV and monitor applications, ensuring optimal performance and reliability for visual displays.

Terminal Finish: TIN LEAD

Tin lead terminal finish enhances solderability, ensuring reliable electrical connections during assembly processes.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning aids in space-efficient layout on PCBs, improving design flexibility in electronic configurations.

Minimum Supply Voltage (Vsup): 10 V

A minimum supply voltage of 10V allows for operation in low-voltage environments, making the IC versatile for different applications.

Technology: BIPOLAR

Bipolar technology provides high performance in terms of speed and power, making it an excellent choice for signal processing in display devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate secure mounting and reliable connections, especially in applications requiring durability.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA indicates efficient power consumption, contributing to the overall energy efficiency of the device.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for fine pitch board designs, enhancing the density of circuits in compact applications.

Maximum Supply Voltage (Vsup): 35 V

With a maximum supply voltage of 35V, this IC can handle a broad range of inputs, making it suitable for various power supply configurations.

Technical Specifications

Vertical Deflection ICs STV9325 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

34

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

STV9325 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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