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TDA8178

STMicroelectronics

TDA8178 by STMicroelectronics

TDA8178 by STMicroelectronics is a Vertical Deflection IC with 7 terminals, operating voltage of 10-48V. It has a rectangular plastic/epoxy package and operates b/w 0-150 °C. Used in vertical deflection applications due to its through-hole terminal form and IN-LINE package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,683 parts In-Stock

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4,683

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Digiode

USA . 583 parts In-Stock

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583

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Anansix

USA . 233 parts In-Stock

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233

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ECAB

Sweden . 178 parts In-Stock

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178

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Huijzer Components

Netherlands . 150 parts In-Stock

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150

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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100

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LittleDiode

UK . 17 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 1 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,257 parts In-Stock

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$2.209

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$1.988

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$2.209

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$1.988

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MKK Technologies

India . 1,730 parts In-Stock

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$4.154

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DigiPath Technology Company

USA . 1,730 parts In-Stock

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$4.154

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1,730

$4.154

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Corphita

USA . 3,618 parts In-Stock

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Kepictronics

USA . 3,453 parts In-Stock

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Parana Technologies

USA . 1,877 parts In-Stock

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$2.641

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$2.641

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Assy Fe

Spain . 5 parts In-Stock

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Overview

Upgrade your electronics with the TDA8178 by STMicroelectronics, a top-quality Vertical Deflection IC that promises reliability and performance. Manufactured by a trusted brand, this IC is perfect for applications requiring precise vertical deflection control. With a wide range of power supplies supported and a durable package body material, this IC ensures longevity and stability in your devices. Experience seamless operation and superior output with the TDA8178, providing unbeatable value and benefits to customers seeking high-quality vertical deflection solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and lightweight, ensuring the IC is protected from external elements and damage.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and provides efficient use of space.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection purposes, ensuring optimal performance in related applications.

Power Supplies (V): 10/48

Supports a range of power supplies, making it versatile and compatible with different systems.

No. of Terminals: 7

Sufficient number of terminals for connectivity and functionality.

Package Style (Meter): IN-LINE

In-line package style simplifies installation and facilitates space-saving circuit design

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliability and stability under various conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for usage in a wide range of environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides excellent conductivity and solderability.

Terminal Position: ZIG-ZAG

Zig-zag terminal position aids in easy soldering and connectivity.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure mounting and connection to the circuit board.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy assembly and compatibility with standard PCB layouts.

Technical Specifications

Vertical Deflection ICs TDA8178 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T7

JESD-609 Code:

e0

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

10/48

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8178 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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