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STV9379FA

STMicroelectronics

STV9379FA by STMicroelectronics

STV9379FA by STMicroelectronics is a VERTICAL DEFLECTION IC with 7 terminals, operating voltage range of 10-42V. It is used in TV and monitor applications, with temperature range from -20 to 75 °C. Package style is FLANGE MOUNT made of PLASTIC/EPOXY material.

Median Price

$4.980

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 2 parts In-Stock

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$4.980

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Vyrian

USA . 2,432 parts In-Stock

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Anansix

USA . 1,873 parts In-Stock

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Digiode

USA . 831 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 610 parts In-Stock

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610

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Q Components

USA . 604 parts In-Stock

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Electronic Expediters

USA . 250 parts In-Stock

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EMSNET

USA . 133 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 78 parts In-Stock

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LittleDiode

UK . 12 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 4 parts In-Stock

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GES GmbH

Germany . 4 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Donberg Electronics Ltd

Ireland . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 833 parts In-Stock

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$2.100

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$1.890

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$2.100

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MKK Technologies

India . 1,223 parts In-Stock

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$3.950

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DigiPath Technology Company

USA . 1,223 parts In-Stock

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$3.950

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Corphita

USA . 3,926 parts In-Stock

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Kepictronics

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Parana Technologies

USA . 661 parts In-Stock

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$2.511

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Assy Fe

Spain . 4 parts In-Stock

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Overview

The STV9379FA by STMicroelectronics is a superior Vertical Deflection IC that boasts top-notch quality and reliability. Manufactured by the reputable STMicroelectronics, this product offers exceptional performance in TV and monitor applications. With a wide operating temperature range and a maximum supply voltage of 42V, customers can trust in the value and benefits that this advanced IC provides. Upgrade your electronic devices with the STV9379FA for unparalleled results and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the packaging of this IC durable and lightweight, ideal for electronic devices like TVs and monitors.

Power Supplies (V): 42

With a power supply of 42V, this IC can handle high voltage requirements in TV and monitor applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy installation and secure mounting, ensuring stable vertical deflection in electronic displays.

Application: TV; MONITOR

Specifically designed for use in TVs and monitors, this vertical deflection IC is optimized for vertical beam deflection in display screens.

Minimum Supply Voltage (Vsup): 10V

The low minimum supply voltage requirement of 10V makes this IC suitable for energy-efficient electronic devices.

Maximum Supply Voltage (Vsup): 42V

The high maximum supply voltage of 42V ensures compatibility with a wide range of power sources for reliable vertical deflection in electronic displays.

Technical Specifications

Vertical Deflection ICs STV9379FA attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

42

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

42 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

STV9379FA General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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