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TDA9309

STMicroelectronics

TDA9309 by STMicroelectronics

TDA9309 by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates b/w 10-35 V, features a 7-terminal zig-zag layout, and withstands temperatures from -20 °C to 75°C. Its plastic/epoxy package ensures durability in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Semi Source

USA . 8,100 parts In-Stock

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Vyrian

USA . 4,718 parts In-Stock

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4,718

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Digiode

USA . 2,123 parts In-Stock

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2,123

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Anansix

USA . 1,682 parts In-Stock

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1,682

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Huijzer Components

Netherlands . 71 parts In-Stock

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Odyssey Electronics LTD

USA . 47 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 13 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,852 parts In-Stock

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$1.364

100+ parts

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$1.228

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$1.364

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$1.228

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MKK Technologies

India . 1,900 parts In-Stock

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$2.566

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$2.566

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DigiPath Technology Company

USA . 1,900 parts In-Stock

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$2.566

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$2.566

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Corphita

USA . 4,791 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,683 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Parana Technologies

USA . 647 parts In-Stock

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$1.631

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Assy Fe

Spain . 7 parts In-Stock

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Overview

Elevate your display systems with the TDA9309 from STMicroelectronics—a leader in high-quality semiconductor solutions. This robust vertical deflection IC is designed for superior performance in TVs and monitors, ensuring vibrant images and reliable operation across a wide temperature range. With its durable construction and efficient power management, the TDA9309 not only enhances visual clarity but also provides exceptional value, making it the ideal choice for manufacturers seeking quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this IC suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on printed circuit boards, facilitating efficient design and integration.

General IC Type: VERTICAL DEFLECTION IC

Specialized for vertical deflection tasks, this IC is ideal for applications in TVs and monitors, ensuring precise performance.

Power Supplies (V): 10/35

Supports a wide range of power supply voltages, offering flexibility in design configurations for different applications.

No. of Terminals: 7

With 7 terminals, it provides multiple connection points for enhanced functionality and easier circuit integration.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides robust mechanical support, ensuring stability in high-vibration environments typical in consumer electronics.

Application: TV; MONITOR

Specifically designed for televisions and monitors, this IC is optimized for performance in these applications, enhancing display quality.

Maximum Operating Temperature: 75 °C

A maximum operating temperature of 75 °C ensures reliable operation in moderately high-temperature environments.

Minimum Operating Temperature: -20 °C

Capable of functioning at temperatures as low as -20 °C, making it suitable for various climate conditions and applications.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning allows for effective space management and ease of mounting on PCBs.

Minimum Supply Voltage (Vsup): 10 V

Minimum supply voltage of 10V ensures compatibility with a variety of power supply systems in consumer electronics.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade indicates reliability over a broader temperature range, suitable for diverse environments.

Technology: BIPOLAR

Bipolar technology enables high-speed operation and improved performance characteristics, suitable for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide superior mechanical strength and stability, beneficial for long-term reliability in mechanical assemblies.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easy soldering and enhances compatibility with existing PCB designs.

Maximum Supply Voltage (Vsup): 35 V

The capability to handle up to 35V makes the IC versatile and safe for high voltage applications, reducing the risk of overload.

Technical Specifications

Vertical Deflection ICs TDA9309 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

10/35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA9309 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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