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LA78045

Onsemi

LA78045 by Onsemi

LA78045 by Onsemi is a Vertical Deflection IC with 7 terminals and operates on 24V power supply. It has a rectangular package shape made of plastic/epoxy, suitable for applications requiring vertical deflection in TVs and monitors. With an operating temperature range from -20 °C to 85°C, it offers reliable performance in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 2,403 parts In-Stock

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Vyrian

USA . 2,162 parts In-Stock

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Electronics Depot

USA . 880 parts In-Stock

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Donberg Electronics Ltd

Ireland . 2 parts In-Stock

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Kulean Microsystems

USA . 8,048 parts In-Stock

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SupplyDigital Components

Austria . 6,597 parts In-Stock

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Problanco Electronics

Mexico . 6,274 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,568 parts In-Stock

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UHIMA Technologies

Türkiye . 615 parts In-Stock

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Corphita

USA . 411 parts In-Stock

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Infinite Electronics LLP (Excess)

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Corohmni

South Africa . 229 parts In-Stock

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Overview

Enhance your electronic devices with the LA78045 Vertical Deflection IC from Onsemi, a trusted manufacturer known for superior quality and reliability. Perfect for applications requiring vertical deflection, this IC offers seamless performance and efficient power supplies at 24V. With its compact package and easy-to-install design, the LA78045 delivers exceptional value and benefits to customers seeking top-notch components for their projects. Upgrade your devices today with the LA78045 and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the IC, making it reliable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and mounting on PCBs, saving space and improving circuit layout.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications in CRT monitors and TVs, ensuring optimal performance.

Power Supplies (V): 24

Operates efficiently at 24V, suitable for a variety of electronic devices and systems.

No. of Terminals: 7

Sufficient number of terminals for connecting to other components in the circuit, facilitating ease of integration.

Package Style (Meter): IN-LINE

In-line package style offers straightforward orientation and alignment during installation, reducing errors.

Maximum Operating Temperature: 85 °C

Capable of operating reliably at high temperatures up to 85 °C, ensuring stability and performance.

Minimum Operating Temperature: -20 °C

Wide temperature range of -20 to 85 °C enables operation in various environmental conditions.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning allows for secure connections and prevents signal interference, enhancing overall signal integrity.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and easy soldering, improving overall reliability and longevity.

Terminal Pitch: 1.27 mm

With a small terminal pitch of 1.27 mm, it enables compact design and efficient use of PCB space.

Technical Specifications

Vertical Deflection ICs LA78045 attributes and parameters. Explore more Vertical Deflection ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T7

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LA78045 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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