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TDA8218

STMicroelectronics

TDA8218 by STMicroelectronics

TDA8218 by STMicroelectronics is a versatile HORIZ/VERT deflection IC designed for applications requiring precise control. It operates b/w 9-10.5V, features a max temp of 70 °C, and includes a blanking output. Ideal for vertical deflection in display systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,752 parts In-Stock

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4,752

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Vyrian

USA . 3,504 parts In-Stock

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Anansix

USA . 336 parts In-Stock

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336

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Fibra_Brandt Electronic GMBH

Germany . 13 parts In-Stock

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ECAB

Sweden . 8 parts In-Stock

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8

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LittleDiode

UK . 3 parts In-Stock

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Goldney Electronics S.L.

Spain . 3 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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GES GmbH

Germany . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,204 parts In-Stock

1+ parts

$0.741

100+ parts

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1k+ parts

$0.667

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1,204

$0.741

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$0.667

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MKK Technologies

India . 1,471 parts In-Stock

1+ parts

$1.393

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1,471

$1.393

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DigiPath Technology Company

USA . 1,471 parts In-Stock

1+ parts

$1.393

100+ parts

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1,471

$1.393

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Corphita

USA . 4,196 parts In-Stock

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4,196

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Parana Technologies

USA . 460 parts In-Stock

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$0.886

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460

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$0.886

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Overview

Unlock the potential of your designs with the TDA8218 from STMicroelectronics, a trusted leader in innovative electronic solutions. This high-quality Vertical Deflection IC enhances performance and reliability in various applications, from televisions to displays. With its robust construction and temperature resilience, the TDA8218 ensures optimal operation in demanding environments, delivering outstanding value and peace of mind for engineers and designers alike. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides excellent insulation and durability, making the product suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient space utilization on the PCB, making it ideal for compact designs.

General IC Type: HORIZ/VERT DEFLECTION IC

Designed specifically for horizontal and vertical deflection applications, ensuring optimal performance in display technologies.

Power Supplies (V): 10

Operating at a standard power supply of 10V makes the IC compatible with most electronic systems, facilitating easy integration.

No. of Terminals: 20

With 20 terminals, the IC offers ample connection points for various functionalities, enhancing its versatility in circuit designs.

Package Style (Meter): IN-LINE

The in-line package style simplifies mounting and soldering processes, making it user-friendly for engineers and reducing assembly time.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in moderately high-temperature environments, extending the product's lifespan.

Blanking Output: YES

The inclusion of a blanking output allows for simplified control in display circuits, providing enhanced functionality in applications like TVs and monitors.

Minimum Operating Temperature: 0 °C

The product can operate in temperatures as low as 0 °C, making it suitable for various ambient conditions and environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability and reliable electrical connections, enhancing the overall performance of the IC in circuits.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout, allowing for easier integration into different designs.

Minimum Supply Voltage (Vsup): 9 V

A minimum supply voltage of 9V allows for a stable performance across various power supply conditions, improving device robustness.

Temperature Grade: COMMERCIAL

Rated for commercial temperatures, this IC is suitable for general consumer electronics, ensuring compatibility with a wide range of applications.

Technology: BIPOLAR

Bipolar technology provides high-speed performance and low power consumption, making the IC efficient and effective for various deflection tasks.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers strong mechanical connections and is preferable for environments that require durability.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm facilitates easy placement and soldering on PCBs, enhancing assembly efficiency.

Maximum Supply Voltage (Vsup): 10.5 V

The maximum supply voltage of 10.5V provides flexibility in design choices while ensuring that the IC operates within safe limits.

Technical Specifications

Vertical Deflection ICs TDA8218 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

10

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

9 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA8218 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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