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TDA8185I

STMicroelectronics

TDA8185I by STMicroelectronics

TDA8185I by STMicroelectronics is a versatile HORIZ/VERT deflection IC designed for TV applications. It operates with a supply voltage range of 4.75V to 5.25V and features 24 terminals in a rectangular plastic package. This bipolar technology IC includes a blanking output for enhanced performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,426 parts In-Stock

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Vyrian

USA . 4,275 parts In-Stock

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4,275

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Anansix

USA . 649 parts In-Stock

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649

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Fibra_Brandt Electronic GMBH

Germany . 42 parts In-Stock

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Donberg Electronics Ltd

Ireland . 31 parts In-Stock

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ECAB

Sweden . 3 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 2 parts In-Stock

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GES GmbH

Germany . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,713 parts In-Stock

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$3.456

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$3.110

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$3.110

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MKK Technologies

India . 1,847 parts In-Stock

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$6.498

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$6.498

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DigiPath Technology Company

USA . 1,847 parts In-Stock

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$6.498

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1,847

$6.498

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Corphita

USA . 3,731 parts In-Stock

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3,731

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Parana Technologies

USA . 2,219 parts In-Stock

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$4.132

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$4.132

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Assy Fe

Spain . 12 parts In-Stock

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12

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Overview

Elevate your display quality with the TDA8185I from STMicroelectronics—an exceptional Vertical Deflection IC that brings superior reliability and performance to your TV applications. Renowned for its innovative technology and robust design, STMicroelectronics ensures that every component meets the highest standards. Enjoy benefits like seamless operation, reduced power consumption, and precise control, all while maximizing the longevity of your devices. Experience excellence in every pixel!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers durability and resistance to environmental factors, making it suitable for long-term applications in consumer electronics.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and improved layout possibilities in circuit designs.

General IC Type: HORIZ/VERT DEFLECTION IC

Specifically designed for horizontal and vertical deflection, this IC is a perfect fit for TV applications where precise control is required.

Power Supplies (V): 5

Operating at a standard 5V supply makes this IC compatible with a wide range of electronic systems, facilitating integration and reducing design complexity.

No. of Terminals: 24

With 24 terminals, this IC offers ample connectivity options to support various functionalities in TV applications.

Package Style (Meter): IN-LINE

The in-line package style ensures straightforward handling and soldering during assembly, promoting manufacturing efficiency.

Application: TV

Designed specifically for television applications, this IC ensures optimal performance in delivering high-quality image deflection.

Blanking Output: YES

The availability of a blanking output feature improves display quality by minimizing screen flicker and enhancing viewer experience.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability and reliable electrical connections, contributing to the longevity of the device.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB design and could potentially simplify the routing of signals.

Minimum Supply Voltage (Vsup): 4.75 V

A minimum supply voltage of 4.75V ensures compatibility with low-voltage applications, providing efficiencies in power management.

Technology: BIPOLAR

Bipolar technology enhances the performance in terms of speed and power consumption, making this IC a high-performance choice for deflection tasks.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate strong mechanical support and electrical connection, which is beneficial for enhancing durability in various applications.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy placement and assembly, promoting design flexibility in circuit board layout.

Maximum Supply Voltage (Vsup): 5.25 V

Operating at a maximum supply voltage of 5.25V provides a safe margin for voltage variations, ensuring reliable operation across different conditions.

Technical Specifications

Vertical Deflection ICs TDA8185I attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA8185I General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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