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TDA9112A

STMicroelectronics

TDA9112A by STMicroelectronics

TDA9112A by STMicroelectronics is a versatile Horiz/Vert Deflection IC designed for monitors, operating b/w 10.8V and 13.2V. It features a dual terminal configuration with a max temp of 70 °C and comes in a compact rectangular package (5.08mm height). Ideal for efficient display control, it ensures reliable performance in commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,762 parts In-Stock

1+ parts

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2,762

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Vyrian

USA . 1,730 parts In-Stock

1+ parts

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1,730

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Digiode

USA . 360 parts In-Stock

1+ parts

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100+ parts

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360

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,771 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

$0.324

10k+ parts

-

1,771

$0.360

-

$0.324

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MKK Technologies

India . 1,074 parts In-Stock

1+ parts

$0.676

100+ parts

-

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10k+ parts

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1,074

$0.676

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DigiPath Technology Company

USA . 1,074 parts In-Stock

1+ parts

$0.676

100+ parts

-

1k+ parts

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10k+ parts

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1,074

$0.676

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A-Z Elektronik GmbH

Germany . 7,260 parts In-Stock

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7,260

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Parana Technologies

USA . 619 parts In-Stock

1+ parts

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100+ parts

$0.430

1k+ parts

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619

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$0.430

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Metaverse IC Inc.

Canada . 580 parts In-Stock

1+ parts

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580

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Kepictronics

USA . 480 parts In-Stock

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480

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Corphita

USA . 380 parts In-Stock

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380

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ChipstoGo Electronic ltd

UK . 96 parts In-Stock

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96

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Overview

Experience unmatched precision in vertical deflection with the TDA9112A by STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a robust solution that enhances monitor performance while ensuring efficient power management. This versatile IC is perfect for applications demanding reliability and clarity, offering exceptional value and performance for your displays. Elevate your projects with superior technology that stands the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials offers robustness and durability, making the IC suitable for various environmental conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, ensuring compatibility with standard layout designs.

General IC Type: HORIZ/VERT DEFLECTION IC

This specific type of IC is essential for monitor applications, providing precise image display control.

Power Supplies: 12 V

Operating at 12 V is typical for monitor electronics, providing a stable and reliable power supply for optimal performance.

No. of Terminals: 32

A higher number of terminals allows for more functionalities and flexibility in circuit designs, enhancing overall performance.

Package Style: IN-LINE, SHRINK PITCH

The in-line, shrink pitch design enables efficient PCB layout and supports higher density packaging.

Application: MONITOR

Specifically designed for monitors, this IC ensures compatibility and optimal performance in display applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the IC can function reliably in relatively high thermal environments.

Blanking Output: YES

The inclusion of a blanking output feature allows for improved image quality and control in display applications.

Minimum Operating Temperature: 0 °C

This IC can operate at temperatures as low as 0 °C, increasing its versatility in different environments.

Terminal Position: DUAL

Dual terminal positions enhance the routing flexibility on the PCB, leading to easier and more efficient circuit designs.

Maximum Seated Height: 5.08 mm

The compact maximum seated height makes this IC suitable for applications where space is a constraint.

Width: 10.16 mm

The width is optimized for standard board layouts, allowing easy integration into existing designs.

Minimum Supply Voltage (Vsup): 10.8 V

The minimum supply voltage ensures that the IC is adaptable to various power supply configurations without affecting performance.

Length: 27.94 mm

The length of the IC is designed for compatibility with standard PCB formats, facilitating easy installation and replacement.

Temperature Grade: COMMERCIAL

Being rated for commercial temperatures, this IC is suited for general consumer electronics applications.

Technology: BICMOS

Utilizing BICMOS technology allows for high-speed performance while maintaining low power consumption, ideal for efficient circuit designs.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides strong mechanical support and is easier to solder, ensuring reliable connections.

Terminal Pitch: 1.778 mm

The terminal pitch allows for good spacing between pins, reducing the risk of solder bridges during assembly.

Maximum Supply Voltage (Vsup): 13.2 V

The ability to operate at a maximum supply voltage of 13.2 V enables compatibility with a wide range of power supply sources.

Technical Specifications

Vertical Deflection ICs TDA9112A attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T32

Length:

27.94 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TDA9112A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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