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STR912FW44X6

STMicroelectronics

STR912FW44X6 by STMicroelectronics

STR912FW44X6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates in extreme temperatures from -40 °C to 85 °C. It features 128 terminals, supports ADC and PWM channels, making it ideal for industrial applications. With a clock speed of up to 25 MHz, it ensures efficient performance in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,629 parts In-Stock

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10,629

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Digiode

USA . 3,608 parts In-Stock

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3,608

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Anansix

USA . 2,551 parts In-Stock

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2,551

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

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15

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Distributors (Availability)

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AZTECH Wire

Italy . 705 parts In-Stock

1+ parts

$16.920

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705

$16.920

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Microchip USA

USA . 250 parts In-Stock

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$18.578

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250

$18.578

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IDEA Electronic Components Group

UK . 1,587 parts In-Stock

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$43.509

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$39.158

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1,587

$43.509

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$39.158

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MKK Technologies

India . 1,125 parts In-Stock

1+ parts

$81.815

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1,125

$81.815

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DigiPath Technology Company

USA . 1,125 parts In-Stock

1+ parts

$81.815

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1,125

$81.815

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Parana Technologies

USA . 1,310 parts In-Stock

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$52.021

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1,310

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$52.021

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Corphita

USA . 591 parts In-Stock

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591

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Perfect Parts

USA . 34 parts In-Stock

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34

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Cyclops Electronics Ltd (Excess)

UK . 15 parts In-Stock

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Overview

Unlock a world of innovation with the STR912FW44X6 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for reliability and exceptional performance, this versatile component excels in industrial automation, consumer electronics, and IoT applications. With its low-power consumption and robust features, it ensures seamless integration and efficiency, empowering your projects while delivering unmatched value and longevity. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount allows for easier integration into compact PCB designs, saving space and enabling more efficient layouts.

Maximum Supply Voltage: 2 V

The low maximum supply voltage helps in reducing power consumption, which is essential for battery-powered devices.

Address Bus Width: 16

A 16-bit address bus width allows for accessing larger memory spaces, improving the flexibility of the microcontroller.

Package Shape: SQUARE

The square package shape is ideal for uniform placement on PCBs, streamlining manufacturing processes.

Bit Size: 32

The 32-bit architecture enhances processing power and capability, enabling more complex calculations and applications.

Power Supplies (V): 1.8, 3/3.3

Multiple voltage options allow for versatile power supply configurations, making it compatible with various systems.

No. of Terminals: 128

A higher number of terminals maximizes I/O capabilities, providing more options for interfacing with peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile and fine pitch design enhances the microcontroller's functionality in space-constrained applications.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage ensures the microcontroller operates efficiently even in power-sensitive applications.

Maximum Operating Temperature: 85 °C

The industrial temperature range allows for reliable operation in harsh environments, making it suitable for industrial applications.

CPU Family: ARM7

Using the ARM7 family, this microcontroller provides strong performance and industry support, ensuring successful deployment.

Minimum Operating Temperature: -40 °C

The wide operating temperature range supports applications in extreme conditions, ensuring functionality in diverse environments.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and reduces the risk of oxidation, ensuring reliable connectivity over time.

ADC Channels: YES

The inclusion of ADC channels allows for direct interfacing with analog sensors, enhancing the microcontroller's versatility.

DMA Channels: YES

DMA channels improve data transfer efficiency, freeing up CPU resources for other tasks and improving performance.

Terminal Position: QUAD

Quad terminal positioning enhances signal integrity and reduces noise in high-performance applications.

ROM Words: 512

A sufficient amount of ROM enables the storage of essential firmware, providing the necessary instructions for operation.

Maximum Seated Height: 1.6 mm

The low seated height allows for sleek designs, facilitating the development of compact electronic devices.

Width: 14 mm

The moderate width strikes a balance between size and performance, making it suitable for a variety of applications.

External Data Bus Width: 16

A 16-bit external data bus allows for efficient data transfer and broader memory access, enhancing processing capabilities.

Maximum Clock Frequency: 25 MHz

A clock frequency of 25 MHz balances power consumption and processing speed, providing reliable performance for many applications.

Length: 14 mm

The compact length complements its width for a balanced overall size, ideal for space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, it ensures reliable performance under rigorous conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances efficiency and performance, making it suitable for a wide range of applications.

RAM Bytes: 98304

Adequate RAM supports complex applications and multitasking, enabling smooth operation of various tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making it ideal for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance connectivity for reliable electrical performance.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage allows for stable operation, balancing performance with energy efficiency.

PWM Channels: YES

PWM capability allows for control of motors and other devices, making it versatile for various applications.

ROM Programmability: FLASH

Flash programmability enables easy updating and customization of firmware, enhancing application flexibility.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for high-density packaging, making it suitable for modern electronic designs.

Speed: 96 rpm

A speed specification enables applications where rotational movement is critical, such as in motors.

No. of I/O Lines: 80

Having 80 I/O lines maximizes connectivity options to peripherals and sensors, increasing the microcontroller's capabilities.

Technical Specifications

Microcontrollers STR912FW44X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

16

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

80

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

512

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STR912FW44X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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