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STR912FW42X6

STMicroelectronics

STR912FW42X6 by STMicroelectronics

STR912FW42X6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates in extreme temperatures from -40 °C to 85 °C. It features 128 terminals, ADC, and PWM channels for versatile applications. Ideal for industrial automation and embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,190 parts In-Stock

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6,190

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Digiode

USA . 2,507 parts In-Stock

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2,507

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Anansix

USA . 646 parts In-Stock

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646

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Pegasus Components GmbH

Germany . 180 parts In-Stock

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180

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Distributors (Availability)

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Microchip USA

USA . 449 parts In-Stock

1+ parts

$1.000

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449

$1.000

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AZTECH Wire

Italy . 830 parts In-Stock

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$9.490

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830

$9.490

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IDEA Electronic Components Group

UK . 1,843 parts In-Stock

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$50.916

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$45.824

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1,843

$50.916

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$45.824

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MKK Technologies

India . 2,375 parts In-Stock

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$95.743

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2,375

$95.743

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DigiPath Technology Company

USA . 2,375 parts In-Stock

1+ parts

$95.743

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2,375

$95.743

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Parana Technologies

USA . 1,668 parts In-Stock

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$60.877

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1,668

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$60.877

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Corphita

USA . 1,390 parts In-Stock

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1,390

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Unlock innovation with the STR912FW42X6 microcontroller from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers unbeatable performance and reliability in diverse applications—from industrial automation to consumer electronics. This powerful ARM7-based controller ensures optimal efficiency while providing robust features like advanced ADC and PWM capabilities. Energize your projects with a trusted solution designed for peak performance, even in demanding environments, securing your competitive edge!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material ensures durability and resistance against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic circuits, enhancing overall design flexibility.

Maximum Supply Voltage: 2 V

Low maximum supply voltage helps in minimizing power consumption, which is critical for battery-operated and energy-efficient devices.

Address Bus Width: 16

A wider address bus allows for more memory access, enabling complex applications and efficient data handling.

Package Shape: SQUARE

Square packages facilitate more even distribution of thermal and electrical characteristics, contributing to reliable performance.

Bit Size: 32

A 32-bit architecture supports advanced computing tasks, allowing the microcontroller to handle complex algorithms more efficiently.

Power Supplies (V): 1.8, 3/3.3

Flexible power supply options provide versatility in designing systems that can operate across different voltage requirements.

No. of Terminals: 128

With 128 terminals, the microcontroller offers extensive connectivity options for interfacing with multiple peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design aids in maximizing space in compact electronic devices while maintaining ease of assembly.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage allows for operation in energy-sensitive applications, further enhancing power efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C guarantees reliability in industrial applications subject to varying thermal conditions.

CPU Family: ARM7

The ARM7 family is known for its efficiency and performance, making it suitable for a variety of embedded applications.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate in extremely low temperatures makes it ideal for harsh environmental conditions.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to process and convert analog signals, which is essential in sensor-based applications.

DMA Channels: YES

DMA channels allow for high-speed data transfer without CPU intervention, improving efficiency in data-intensive applications.

Terminal Position: QUAD

Quad terminal positioning aids in effective signal integrity and reduces parasitic capacitance, ensuring high performance in communications.

ROM Words: 256

Having 256 ROM words provides enough memory space for basic firmware applications, laying a foundation for a diverse range of functions.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm supports low-profile designs, contributing to the overall compactness of electronic assemblies.

Width: 14 mm

At just 14 mm in width, the microcontroller is compact enough for small form factor applications without sacrificing performance.

External Data Bus Width: 16

A 16-bit external data bus increases data throughput, allowing for faster processing and communication with external devices.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz ensures that the microcontroller can execute instructions swiftly, which is crucial for time-sensitive applications.

Length: 14 mm

The compact length of 14 mm allows for efficient use of board space in tightly packed designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this microcontroller can reliably function in diverse and challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it offers reduced instruction set computing advantages, leading to simplified design and improved performance.

RAM Bytes: 98304

With 98304 bytes of RAM, the microcontroller can efficiently handle multiple tasks and buffers, essential for modern applications.

Technology: CMOS

CMOS technology allows for lower power consumption and higher noise immunity, making it a reliable choice for various applications.

Terminal Form: GULL WING

Gull wing terminal forms provide robust mechanical stability and ease of soldering in automatic assembly processes.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V optimizes power consumption, enabling efficient battery-powered designs.

PWM Channels: YES

PWM capabilities allow for precise control of motors and other devices, making this microcontroller suitable for applications requiring nuanced control.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, providing adaptability for future requirements.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm facilitates high-density designs while accommodating advanced manufacturing techniques.

Speed: 96 rpm

A speed rating of 96 rpm indicates the microcontroller's capability to manage systems with varying operational speeds.

No. of I/O Lines: 80

Offering 80 I/O lines, this microcontroller provides extensive options for interfacing with various inputs and outputs, enhancing flexibility in design.

Technical Specifications

Microcontrollers STR912FW42X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

16

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

256

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STR912FW42X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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