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STR912FAW32X6

STMicroelectronics

STR912FAW32X6 by STMicroelectronics

STR912FAW32X6 microcontroller by STMicroelectronics features a 32-bit ARM7 CPU, 262144 ROM words, and 65536 RAM bytes. With CAN, Ethernet, USB connectivity options and 8-Ch 10-Bit ADC channels, it is ideal for industrial applications requiring high-speed processing and multiple peripherals. Operating in a temperature range of -40 to 85 °C, this microcontroller offers versatile performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,395 parts In-Stock

1+ parts

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11,395

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Anansix

USA . 2,416 parts In-Stock

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2,416

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Digiode

USA . 508 parts In-Stock

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508

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 409 parts In-Stock

1+ parts

$8.778

100+ parts

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409

$8.778

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AZTECH Wire

Italy . 1,083 parts In-Stock

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$19.630

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1,083

$19.630

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IDEA Electronic Components Group

UK . 1,156 parts In-Stock

1+ parts

$33.420

100+ parts

-

1k+ parts

$30.078

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1,156

$33.420

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$30.078

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MKK Technologies

India . 1,413 parts In-Stock

1+ parts

$62.844

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1,413

$62.844

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DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$62.844

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1,413

$62.844

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Component Stockers USA

USA . 484 parts In-Stock

1+ parts

$99.990

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484

$99.990

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Assy Fe

Spain . 2,700 parts In-Stock

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2,700

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Corphita

USA . 747 parts In-Stock

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747

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Parana Technologies

USA . 252 parts In-Stock

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$39.959

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252

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$39.959

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Overview

Experience the power of the STR912FAW32X6 microcontroller by STMicroelectronics, a leading manufacturer known for superior quality and reliability. This versatile device is perfect for a wide range of applications, offering customers unmatched value and benefits. With advanced features like multiple connectivity options, high-speed performance, and ample memory capacity, this product delivers exceptional functionality and efficiency. Trust in STMicroelectronics to provide innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the package, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 2 V

Operating at a maximum supply voltage of 2V makes this microcontroller energy-efficient and suitable for low power applications.

Bit Size: 32

32-bit architecture provides high processing power and performance, allowing for complex operations and calculations.

Power Supplies (V): 1.8,3/3.3

Supporting multiple power supply options ensures flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 128

Having 128 terminals allows for versatile connectivity options and integration with peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles offers space-saving design and facilitates high-density mounting on PCBs.

Minimum Supply Voltage: 1.65 V

Operating at a minimum supply voltage of 1.65V enables energy efficiency and extends the battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for industrial applications where elevated temperatures may be present.

CPU Family: ARM7

Being part of the ARM7 CPU family ensures compatibility with a wide range of software and development tools, making it easier to program and integrate into projects.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller can withstand cold environments or start-up conditions without performance degradation.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing and conversion, enabling sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, reducing CPU workload and improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers a balanced layout for easy PCB routing, ensuring signal integrity and minimizing interference.

ROM Words: 262144

With 262144 ROM words, this microcontroller provides ample storage for program code and data, enabling complex applications and firmware updates.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6mm allows for compact and slim designs, ideal for space-constrained applications or portable devices.

Width: 14 mm

A width of 14mm offers a compact form factor, enabling placement in tight spaces or integration into small electronic devices.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

A wide range of peripherals such as Brown Out Detector, DMA, Power-On Reset, Real-Time Clock, Timers, and Watchdog Timer enhance the microcontroller's functionality and versatility.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25MHz allows for high-speed processing, rapid response times, and efficient execution of tasks.

Length: 14 mm

A length of 14mm contributes to the compact form factor of the microcontroller, enabling versatile placement options and space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments with varying temperature conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller architecture with Reduced Instruction Set Computing (RISC) design offers efficient and streamlined operation, optimal for embedded systems and IoT applications.

RAM Bytes: 65536

With 65536 bytes of RAM, this microcontroller provides sufficient memory for data storage, buffer management, and efficient multitasking.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliable operation, making the microcontroller suitable for battery-powered devices and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form offers robust solder connections, easy inspection, and good mechanical strength, ensuring reliable connectivity and durability.

Analog To Digital Convertors: 8-Ch 10-Bit

8-channel 10-bit ADCs provide accurate analog-to-digital conversion, enabling precise measurement of sensor inputs and signal processing.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V ensures compatibility with low-power components and helps in reducing overall power consumption in the system.

PWM Channels: YES

Support for PWM channels enables precise control of motor speeds, LED brightness, and other applications requiring pulse-width modulation for variable output levels.

Connectivity: CAN, ETHERNET, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Diverse connectivity options including CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART, and USB allow for seamless integration with external devices, networks, and peripherals.

ROM Programmability: FLASH

Flash programmability enables easy firmware updates, reprogramming of code, and flexible storage options, enhancing the microcontroller's versatility and adaptability to changing requirements.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm allows for high-density packaging, precise soldering, and efficient PCB layout, contributing to overall miniaturization and space optimization.

Speed: 96 rpm

Operating at a speed of 96 RPM, this microcontroller offers rapid data processing, quick response times, and efficient performance in real-time applications.

On Chip Program ROM Width: 8

An on-chip program ROM width of 8 bits provides ample storage for program code, data, and instructions, enabling efficient execution of tasks and optimized performance.

No. of I/O Lines: 80

Having 80 I/O lines allows for versatile connectivity options and interface with external devices, sensors, and peripherals, enhancing the microcontroller's functionality and flexibility.

Technical Specifications

Microcontrollers STR912FAW32X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR912FAW32X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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