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STR911FAM44X6T

STMicroelectronics

STR911FAM44X6T by STMicroelectronics

STR911FAM44X6T from STMicroelectronics is a 32-bit ARM7 microcontroller ideal for industrial applications. It features a max supply voltage of 3.3V, operates in -40 °C to 85°C, and includes 8 ADC channels for versatile data processing. Its compact design supports various connectivity options like CAN and USB.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,986 parts In-Stock

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Chip Stock

USA . 4,120 parts In-Stock

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Digiode

USA . 3,979 parts In-Stock

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3,979

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Anansix

USA . 692 parts In-Stock

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AZTECH Wire

Italy . 1,194 parts In-Stock

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$12.780

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$12.780

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IDEA Electronic Components Group

UK . 611 parts In-Stock

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$47.012

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$42.311

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611

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Microchip USA

USA . 116 parts In-Stock

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$47.137

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MKK Technologies

India . 528 parts In-Stock

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$88.403

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528

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DigiPath Technology Company

USA . 528 parts In-Stock

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$88.403

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Component Stockers USA

USA . 517 parts In-Stock

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$99.990

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Corphita

USA . 4,789 parts In-Stock

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Parana Technologies

USA . 1,756 parts In-Stock

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$56.210

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Overview

Unlock your project's potential with the STR911FAM44X6T microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics provides this versatile, low-profile solution perfect for demanding applications across industrial automation, IoT, and consumer electronics. Enjoy exceptional performance with a robust 32-bit ARM7 architecture, enhanced connectivity options, and reliable operation in extreme temperatures. Elevate your designs with unmatched efficiency and reliability!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for compact designs and easy integration into modern PCBs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 2 V

Low maximum supply voltage enables energy-efficient operation, beneficial for battery-powered devices and minimizing power consumption.

Package Shape: SQUARE

A square package shape provides symmetry in layout and alignment, facilitating more predictable thermal and electrical performance.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and supports advanced processing functions, enhancing performance.

Power Supplies: 1.8, 3/3.3 V

Support for multiple supply voltages adds flexibility for developers and compatibility with various application requirements.

No. of Terminals: 80

A higher number of terminals allows for greater connectivity options, facilitating the integration of multiple peripherals and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design is ideal for compact applications, promoting ease of assembly in tight spaces.

Minimum Supply Voltage: 1.65 V

This low minimum voltage ensures that the microcontroller can operate efficiently even under low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the microcontroller suitable for industrial applications where devices might be exposed to elevated temperatures.

CPU Family: ARM7

Utilizing the ARM7 CPU family allows for efficient processing and robust performance in a wide range of applications.

Minimum Operating Temperature: -40 °C

Able to operate at very low temperatures, this microcontroller is suitable for applications in harsh environmental conditions.

ADC Channels: YES

Having ADC channels enables the microcontroller to process analog signals, expanding its usability in sensor-driven applications.

DMA Channels: YES

DMA support facilitates high-speed data transfer between peripherals, reducing CPU load and improving overall efficiency.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing on the PCB and enhances soldering reliability in assembly processes.

ROM Words: 524288

A substantial amount of on-chip ROM provides ample space for code storage, allowing for complex applications to be run directly on the microcontroller.

Maximum Seated Height: 1.6 mm

The low seated height is beneficial for keeping the overall profile of the device low, important for portable designs.

Width: 12 mm

A compact width enhances flexibility in system design, allowing integration into smaller enclosures.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Rich set of peripherals enhances functionality, providing built-in support for essential features like real-time clock and watchdog timer.

Maximum Clock Frequency: 25 MHz

With a maximum clock frequency of 25 MHz, this microcontroller is capable of executing instructions swiftly, improving overall system responsiveness.

Length: 12 mm

Compact overall dimensions facilitate easy integration into devices with space constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and durability in demanding environments typical in industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Employing RISC architecture enhances processing efficiency and speed, leading to improved performance in embedded applications.

RAM Bytes: 98304

Significant RAM capacity allows for complex variable storage and improves multitasking capabilities of the microcontroller.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high-speed operation, ideal for portable electronics.

Terminal Form: GULL WING

Gull wing terminals are commonly used for surface mounting, providing ease of soldering and enhanced mechanical strength.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple ADC channels provide versatility in input signal processing, making it suitable for sensor applications such as temperature and pressure monitoring.

Nominal Supply Voltage: 1.8 V

Operating at a nominal voltage of 1.8 V further emphasizes energy efficiency, essential for battery-operated systems.

PWM Channels: YES

Support for PWM channels allows for efficient control of motors and actuators, facilitating applications in robotics and automation.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Rich connectivity options enable interaction with a wide range of devices and networks, making it highly versatile for various applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the firmware, extending the product lifecycle and adaptability.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for more compact routing on the PCB, which is essential for high-density applications.

Speed: 96 rpm

Good speed capabilities indicate suitability for real-time processing applications, enhancing responsiveness and performance.

On Chip Program ROM Width: 8

Having an 8-bit program ROM width supports efficient code execution and is compatible with a variety of programming environments.

No. of I/O Lines: 40

40 I/O lines provide adequate connectivity for a wide range of peripherals and external devices, enhancing application flexibility.

Technical Specifications

Microcontrollers STR911FAM44X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR911FAM44X6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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