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STR910FAM32X6

STMicroelectronics

STR910FAM32X6 by STMicroelectronics

STR910FAM32X6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 80 terminals, 8 ADC channels, and supports various connectivity options like CAN and UART. Ideal for industrial applications requiring robust performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,858 parts In-Stock

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8,858

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Digiode

USA . 3,819 parts In-Stock

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3,819

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Anansix

USA . 2,168 parts In-Stock

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2,168

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Cogito LLC

Ukraine . 16 parts In-Stock

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16

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Distributors (Availability)

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Microchip USA

USA . 296 parts In-Stock

1+ parts

$19.279

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296

$19.279

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AZTECH Wire

Italy . 238 parts In-Stock

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$20.170

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238

$20.170

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IDEA Electronic Components Group

UK . 1,864 parts In-Stock

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$64.637

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$58.174

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1,864

$64.637

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$58.174

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MKK Technologies

India . 2,000 parts In-Stock

1+ parts

$121.546

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2,000

$121.546

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DigiPath Technology Company

USA . 2,000 parts In-Stock

1+ parts

$121.546

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2,000

$121.546

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Corphita

USA . 4,284 parts In-Stock

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4,284

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Parana Technologies

USA . 1,086 parts In-Stock

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$77.284

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1,086

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$77.284

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Overview

Unlock the power of innovation with the STR910FAM32X6 microcontroller from STMicroelectronics. Designed for high-performance applications, this versatile and reliable component excels in industrial environments, offering exceptional processing capabilities and extensive connectivity options. With ST's renowned quality and commitment to excellence, elevate your projects with a solution that ensures efficiency and longevity—perfect for automotive, IoT, and automation systems. Experience the future of embedded technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and better performance in high-density designs.

Maximum Supply Voltage: 2 V

A low maximum supply voltage requirement helps in power-sensitive applications, contributing to overall energy efficiency.

Package Shape: SQUARE

The square package shape aids in uniform thermal distribution and simplifies layout design.

Bit Size: 32

The 32-bit architecture allows for processing larger data sets and more complex calculations compared to 8 or 16-bit microcontrollers.

Power Supplies (V): 3/3.3

Versatility in power supply options allows for easy integration into existing systems.

No. of Terminals: 80

A higher number of terminals enables richer I/O capabilities, making it suitable for more complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design is ideal for space-constrained applications while maintaining robustness.

Minimum Supply Voltage: 1.65 V

This low minimum supply voltage further enhances power efficiency and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature rating ensures reliability in industrial environments.

CPU Family: ARM7

The ARM7 CPU family is well-known for its efficiency and performance, making it a trusted choice in the industry.

Minimum Operating Temperature: -40 °C

A wide temperature range makes this microcontroller suitable for harsh environments, ensuring consistent performance.

ADC Channels: YES

Integrated ADC channels allow for easy interfacing with analog signals, expanding the use cases.

DMA Channels: YES

DMA channels improve data transfer efficiency, significantly enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positions optimize layout and facilitate easier connections on the PCB.

ROM Words: 262144

A substantial ROM capacity allows for more complex applications and firmware.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for designs that require a compact footprint.

Width: 12 mm

Standard width makes it compatible with a variety of PCB layouts.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

A rich set of peripherals enhances functionality and allows for diverse application development.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for fast processing, suitable for real-time applications.

Length: 12 mm

Similar to the width, the length of 12 mm keeps the design compact and manageable.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller enhances processing speed and efficiency.

RAM Bytes: 65536

Adequate RAM capacity supports complex computations and data management.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing leads facilitate easier soldering and enhance reliability of connections.

Analog To Digital Convertors: 8-Ch 10-Bit

The presence of 8 channels allows multiple analog signals to be processed simultaneously.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage further supports power efficiency in low-power applications.

PWM Channels: YES

Integrated PWM channels are essential for motor control and modulation tasks.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Diverse connectivity options ease integration with various sensors and communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in firmware development.

Terminal Pitch: 0.5 mm

A finer terminal pitch supports high-density designs, enhancing performance in compact applications.

Speed: 96 rpm

Optimum operational speed supports various applications, particularly in control systems.

On Chip Program ROM Width: 8

The 8-bit ROM width strikes a balance between performance and memory management.

No. of I/O Lines: 40

A large number of I/O lines provides extensive interfacing capabilities for diverse applications.

Technical Specifications

Microcontrollers STR910FAM32X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAM32X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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