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STI28N60M2

STMicroelectronics

STI28N60M2 by STMicroelectronics

STI28N60M2 by STMicroelectronics is a N-CHANNEL FET with 600V DS breakdown voltage, 88A IDM, and 0.15 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with 170W max power dissipation.

Median Price

$3.625

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,848 parts In-Stock

1+ parts

$3.330

100+ parts

$1.500

1k+ parts

$1.430

10k+ parts

-

1,848

$3.330

$1.500

$1.430

-

DigiKey

USA . 5,945 parts In-Stock

1+ parts

$3.920

100+ parts

$2.150

1k+ parts

$1.474

10k+ parts

$1.316

5,945

$3.920

$2.150

$1.474

$1.316

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,414 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

-

2,414

$2.670

-

-

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Vyrian

USA . 3,318 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

-

10k+ parts

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3,318

$2.810

-

-

-

Anansix

USA . 946 parts In-Stock

1+ parts

-

100+ parts

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946

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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500

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 477 parts In-Stock

1+ parts

$0.320

100+ parts

-

1k+ parts

$0.288

10k+ parts

-

477

$0.320

-

$0.288

-

MKK Technologies

India . 943 parts In-Stock

1+ parts

$0.602

100+ parts

-

1k+ parts

-

10k+ parts

-

943

$0.602

-

-

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DigiPath Technology Company

USA . 943 parts In-Stock

1+ parts

$0.602

100+ parts

-

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-

10k+ parts

-

943

$0.602

-

-

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Ampacity Inc.

Singapore . 3,587 parts In-Stock

1+ parts

$2.390

100+ parts

-

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3,587

$2.390

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Corphita

USA . 935 parts In-Stock

1+ parts

$2.529

100+ parts

-

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-

10k+ parts

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935

$2.529

-

-

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Component Stockers USA

USA . 9,523 parts In-Stock

1+ parts

$3.230

100+ parts

$1.980

1k+ parts

$1.670

10k+ parts

-

9,523

$3.230

$1.980

$1.670

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Microchip USA

USA . 8,747 parts In-Stock

1+ parts

$22.555

100+ parts

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10k+ parts

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8,747

$22.555

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Alle Elektronik GmbH

Germany . 4,135 parts In-Stock

1+ parts

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4,135

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,288 parts In-Stock

1+ parts

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1,288

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Parana Technologies

USA . 286 parts In-Stock

1+ parts

-

100+ parts

$0.383

1k+ parts

-

10k+ parts

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286

-

$0.383

-

-

Overview

Unleash the power of innovation with the STI28N60M2 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors designed for superior performance in switching applications. The STI28N60M2 features a single configuration with a built-in diode, enhancing efficiency and reliability. With a maximum operating temperature of 150°C and a minimum operating temperature of -55°C, this transistor offers unmatched durability and versatility. Experience the benefits of enhanced mode operation and a maximum pulsed drain current of 88A, making it ideal for a wide range of industrial and commercial applications. Elevate your projects with the STI28N60M2 and unlock endless possibilities in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower ON resistance compared to P-channel FETs.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high power applications and voltages without getting damaged.

Maximum Pulsed Drain Current (IDM): 88 A

The high pulsed drain current rating allows for handling heavy loads and high transient currents.

Maximum Power Dissipation (Abs): 170 W

The high power dissipation rating indicates that this FET can handle high power levels without overheating.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate in harsh environments without issues.

Technical Specifications

Power Field Effect Transistors (FET) STI28N60M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI28N60M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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