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STI200N6F3

STMicroelectronics

STI200N6F3 by STMicroelectronics

STI200N6F3 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 120 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for high-power circuits, it ensures reliable performance with minimal resistance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,718 parts In-Stock

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3,718

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Digiode

USA . 1,524 parts In-Stock

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1,524

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Anansix

USA . 164 parts In-Stock

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164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$1.170

100+ parts

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$1.053

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636

$1.170

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$1.053

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MKK Technologies

India . 2,163 parts In-Stock

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$2.201

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2,163

$2.201

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DigiPath Technology Company

USA . 2,163 parts In-Stock

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$2.201

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2,163

$2.201

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AZTECH Wire

Italy . 857 parts In-Stock

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$14.570

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857

$14.570

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Component Stockers USA

USA . 743 parts In-Stock

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$99.990

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743

$99.990

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Alle Elektronik GmbH

Germany . 4,887 parts In-Stock

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Corphita

USA . 2,195 parts In-Stock

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2,195

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Parana Technologies

USA . 1,476 parts In-Stock

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$1.399

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1,476

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$1.399

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Overview

Unlock unparalleled performance with the STI200N6F3 from STMicroelectronics, a leader in innovative power solutions. This high-quality N-channel FET is designed for efficient switching applications, ensuring reliability in demanding environments. With its robust construction and impressive capabilities, the STI200N6F3 delivers exceptional value, reducing energy losses while maximizing throughput. Elevate your projects with this trusted component, perfect for industrial automation, renewable energy systems, and more!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and heat resistance, ensuring the transistor is suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for better electron mobility, resulting in higher efficiency and faster switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by eliminating the need for external protection diodes.

Transistor Application: SWITCHING

Designed for switching applications, making it ideal for power supply and control circuits.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60 V makes this FET suitable for a wide range of voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on printed circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a robust connection to the PCB, enhancing reliability in demanding applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption in standby and active states.

Maximum Pulsed Drain Current (IDM): 480 A

A high pulsed current rating allows the FET to handle large surges of current, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 918 mJ

The high avalanche energy rating provides protection against voltage spikes, enhancing the reliability of the device.

Maximum Drain Current (Abs) (ID): 120 A

A maximum drain current rating of 120 A makes this FET capable of handling significant loads.

No. of Terminals: 3

Three terminals streamline integration into circuits and facilitate easier connections.

Maximum Power Dissipation (Abs): 330 W

A high power dissipation rating ensures that the transistor can operate effectively without overheating.

Package Style (Meter): IN-LINE

The in-line package style is easy to mount and offers good compatibility with a variety of PCB designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high input impedance and fast switching capabilities, making it ideal for modern circuits.

Maximum Operating Temperature: 175 °C

A high operating temperature limit allows the FET to function in demanding environments without failure.

Transistor Element Material: SILICON

Silicon material, widely used in electronics, offers good thermal conductivity and high-performance characteristics.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and provides good corrosion resistance for reliable connections.

Maximum Drain-Source On Resistance: 0.0038 ohm

A very low on-resistance ensures minimal power loss and improved efficiency during operation.

Terminal Position: SINGLE

Single terminal position simplifies design and layout, making it easier to integrate into various circuit configurations.

Technical Specifications

Power Field Effect Transistors (FET) STI200N6F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

918 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI200N6F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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