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STI24NM60N

STMicroelectronics

STI24NM60N by STMicroelectronics

STI24NM60N by STMicroelectronics is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features 68A IDM, 300mJ EAS, and 0.19 ohm RDS(on). The transistor operates in ENHANCEMENT MODE with METAL-OXIDE SEMICONDUCTOR technology and SILICON element material.

Median Price

$3.950

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 973 parts In-Stock

1+ parts

$1.782

100+ parts

-

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-

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973

$1.782

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Chip1Stop

Japan . 973 parts In-Stock

1+ parts

$1.960

100+ parts

-

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973

$1.960

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Farnell

UK . 290 parts In-Stock

1+ parts

$3.950

100+ parts

$1.900

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-

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290

$3.950

$1.900

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Element14

Singapore . 290 parts In-Stock

1+ parts

$5.900

100+ parts

$4.010

1k+ parts

$3.200

10k+ parts

-

290

$5.900

$4.010

$3.200

-

DigiKey

USA . 979 parts In-Stock

1+ parts

$6.190

100+ parts

$2.976

1k+ parts

$2.321

10k+ parts

$2.227

979

$6.190

$2.976

$2.321

$2.227

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$6.190

100+ parts

$2.940

1k+ parts

$2.580

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-

1

$6.190

$2.940

$2.580

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Avnet

USA . 1,700 parts In-Stock

1+ parts

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1,700

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Verical

USA . 973 parts In-Stock

1+ parts

-

100+ parts

$1.782

1k+ parts

-

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973

-

$1.782

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,798 parts In-Stock

1+ parts

$0.200

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3,798

$0.200

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Vyrian

USA . 13,223 parts In-Stock

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13,223

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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1,000

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ComSIT USA

USA . 1,000 parts In-Stock

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1,000

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Anansix

USA . 472 parts In-Stock

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472

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Distributors (Availability)

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Ampacity Inc.

Singapore . 251 parts In-Stock

1+ parts

$0.178

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251

$0.178

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Corphita

USA . 312 parts In-Stock

1+ parts

$0.189

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312

$0.189

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IDEA Electronic Components Group

UK . 911 parts In-Stock

1+ parts

$1.355

100+ parts

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$1.220

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911

$1.355

-

$1.220

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Component Stockers USA

USA . 1,785 parts In-Stock

1+ parts

$1.810

100+ parts

$1.810

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1,785

$1.810

$1.810

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MKK Technologies

India . 570 parts In-Stock

1+ parts

$2.548

100+ parts

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570

$2.548

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DigiPath Technology Company

USA . 570 parts In-Stock

1+ parts

$2.548

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570

$2.548

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Microchip USA

USA . 3,858 parts In-Stock

1+ parts

$14.616

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3,858

$14.616

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A-Z Elektronik GmbH

Germany . 6,182 parts In-Stock

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Perfect Parts

USA . 4,243 parts In-Stock

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4,243

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Parana Technologies

USA . 1,522 parts In-Stock

1+ parts

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100+ parts

$1.620

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1,522

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$1.620

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Alle Elektronik GmbH

Germany . 987 parts In-Stock

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987

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Overview

Experience the superior quality and reliability of STMicroelectronics with the STI24NM60N Power Field Effect Transistor. Designed for switching applications, this N-CHANNEL transistor offers a maximum drain current of 17A and a low on-resistance of just 0.19 ohms. With a built-in diode and a breakdown voltage of 600V, this transistor provides efficient performance and enhanced protection. Whether you're in the automotive, industrial, or consumer electronics industry, the STI24NM60N delivers exceptional value and performance for your power management needs. Elevate your designs with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, ensuring long-term reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and higher electron mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide protection against back EMF, making this transistor suitable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current in electronic circuits.

Minimum DS Breakdown Voltage: 600 V

With a minimum breakdown voltage of 600V, this transistor can handle high voltage applications with ease.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high input impedance, low input capacitance, and fast switching speed, making this FET a reliable choice for various applications.

Maximum Drain Current (ID): 17 A

With a maximum drain current of 17A, this transistor can handle high current loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.19 ohm

The low ON resistance ensures minimal power dissipation and heat generation, improving the efficiency of the transistor in switching applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage at the gate terminal to turn on, offering better control and protection against accidental turn-on.

Technical Specifications

Power Field Effect Transistors (FET) STI24NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

68 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI24NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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