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STI24N60M2

STMicroelectronics

STI24N60M2 by STMicroelectronics

STI24N60M2 by STMicroelectronics is a N-CHANNEL FET with 600V DS Breakdown Voltage and 72A IDM. Ideal for SWITCHING applications, it features 0.19 ohm Drain-Source On Resistance and 180mJ EAS rating.

Median Price

$2.970

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 205 parts In-Stock

1+ parts

$2.970

100+ parts

$1.330

1k+ parts

$1.040

10k+ parts

-

205

$2.970

$1.330

$1.040

-

DigiKey

USA . 165 parts In-Stock

1+ parts

$2.970

100+ parts

$1.329

1k+ parts

$0.993

10k+ parts

$0.903

165

$2.970

$1.329

$0.993

$0.903

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,815 parts In-Stock

1+ parts

$2.318

100+ parts

-

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2,815

$2.318

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Vyrian

USA . 752 parts In-Stock

1+ parts

$2.440

100+ parts

-

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752

$2.440

-

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Anansix

USA . 1,887 parts In-Stock

1+ parts

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1,887

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ComSIT Distribution GmbH

Germany . 1,238 parts In-Stock

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1,238

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,891 parts In-Stock

1+ parts

$0.385

100+ parts

-

1k+ parts

$0.346

10k+ parts

-

1,891

$0.385

-

$0.346

-

MKK Technologies

India . 857 parts In-Stock

1+ parts

$0.723

100+ parts

-

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-

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857

$0.723

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DigiPath Technology Company

USA . 857 parts In-Stock

1+ parts

$0.723

100+ parts

-

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-

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857

$0.723

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-

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Advanced Electronics

New Zealand . 36 parts In-Stock

1+ parts

$2.172

100+ parts

$1.977

1k+ parts

$1.781

10k+ parts

-

36

$2.172

$1.977

$1.781

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Corphita

USA . 4,642 parts In-Stock

1+ parts

$2.196

100+ parts

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4,642

$2.196

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Microchip USA

USA . 3,146 parts In-Stock

1+ parts

$18.135

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3,146

$18.135

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Infinite Electronics LLP (Excess)

. 108,002 parts In-Stock

1+ parts

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108,002

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A-Z Elektronik GmbH

Germany . 6,489 parts In-Stock

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6,489

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Perfect Parts

USA . 2,220 parts In-Stock

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2,220

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Parana Technologies

USA . 2,033 parts In-Stock

1+ parts

-

100+ parts

$0.460

1k+ parts

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2,033

-

$0.460

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Overview

Unleash the power of innovation with the STI24N60M2 Power Field Effect Transistor by STMicroelectronics. Designed with precision and quality in mind, this N-CHANNEL transistor boasts a single configuration with a built-in diode, making it ideal for switching applications. With a high DS Breakdown Voltage of 600V and maximum Drain Current of 18A, this transistor delivers exceptional performance and reliability. Whether you're in the industrial, automotive, or consumer electronics sector, this product offers unmatched value, efficiency, and versatility for all your power management needs. Experience the difference with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the FET, making it suitable for long-term use in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds compared to P-channel FETs, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient switching operations, enhancing the performance of the FET in various circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current in electronic circuits, making it a reliable choice for switching tasks.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage rating allows this FET to handle high voltages without breakdown, making it suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape provides easy mounting and installation in circuit boards, ensuring a secure fit for reliable operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and stable connection to the circuit board, ensuring proper electrical contact for efficient performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to use in circuits as they are normally off and require a positive voltage to turn on, providing better control over switching operations.

Maximum Pulsed Drain Current (IDM): 72 A

The high pulsed drain current rating allows this FET to handle sudden surges of current without damage, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 180 mJ

The high avalanche energy rating indicates the FET's ability to withstand short-duration high-energy pulses, ensuring reliability in demanding operating conditions.

No. of Terminals: 3

With three terminals, this FET provides easy connectivity to external circuits, enabling efficient control over current flow and switching operations.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into circuit designs, providing a compact and space-saving solution for electronic applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance and reliability in FET operation, making it a durable and efficient choice for electronic circuits.

Transistor Element Material: SILICON

Silicon-based FETs offer high switching speeds and low ON-resistance, providing efficient performance in a wide range of electronic applications.

Maximum Drain Current (ID): 18 A

The high maximum drain current rating allows this FET to handle continuous current flow without overheating, making it reliable for long-term use in high-power circuits.

Maximum Drain-Source On Resistance: 0.19 ohm

With a low drain-source ON resistance, this FET can efficiently control current flow with minimal power loss, ensuring efficient operation in various applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection setup and reduces complexity in circuit designs, making it easy to integrate this FET into electronic systems.

Case Connection: DRAIN

The drain case connection provides a secure and reliable electrical connection, ensuring proper heat dissipation and efficient performance in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) STI24N60M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

72 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI24N60M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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