Loading...

STI25NM60ND

STMicroelectronics

STI25NM60ND by STMicroelectronics

STI25NM60ND from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 21A max drain current, and 160W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,848

-

-

-

-

Digiode

USA . 2,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,975

-

-

-

-

Anansix

USA . 2,542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,542

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 152 parts In-Stock

1+ parts

$0.901

100+ parts

-

1k+ parts

$0.811

10k+ parts

-

152

$0.901

-

$0.811

-

MKK Technologies

India . 721 parts In-Stock

1+ parts

$1.694

100+ parts

-

1k+ parts

-

10k+ parts

-

721

$1.694

-

-

-

DigiPath Technology Company

USA . 721 parts In-Stock

1+ parts

$1.694

100+ parts

-

1k+ parts

-

10k+ parts

-

721

$1.694

-

-

-

AZTECH Wire

Italy . 681 parts In-Stock

1+ parts

$19.560

100+ parts

-

1k+ parts

-

10k+ parts

-

681

$19.560

-

-

-

Alle Elektronik GmbH

Germany . 4,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,468

-

-

-

-

Corphita

USA . 1,886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,886

-

-

-

-

Parana Technologies

USA . 73 parts In-Stock

1+ parts

-

100+ parts

$1.077

1k+ parts

-

10k+ parts

-

73

-

$1.077

-

-

Overview

Unlock unparalleled performance with the STI25NM60ND from STMicroelectronics, a leading name in innovative semiconductor solutions. This robust N-channel power FET excels in switching applications, offering exceptional reliability and efficiency for your designs. With a remarkable breakdown voltage of 600V and built-in diode, it ensures seamless operation under demanding conditions. Elevate your projects with ST's commitment to quality and engineering excellence—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides good insulation and protection against environmental factors, enhancing reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency, making them preferable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy integration in certain topologies, improving circuit design flexibility.

Transistor Application: SWITCHING

Optimized for switching applications, this FET provides fast response times necessary for effective control in electronic circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures that the FET can operate safely in high-voltage environments, offering greater application versatility.

Package Shape: RECTANGULAR

The rectangular package design is space-efficient and suits PCB layouts, facilitating easier integration into various systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, ideal for high-power applications demanding reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low standby power consumption and high efficiency, making it suitable for power-sensitive applications.

Maximum Pulsed Drain Current (IDM): 84 A

The ability to handle high pulsed drain current means this FET can manage transient loads effectively, making it ideal for fluctuating power conditions.

Avalanche Energy Rating (EAS): 850 mJ

A high avalanche energy rating indicates robustness against overvoltage events, ensuring durability under stressful conditions.

Maximum Drain Current (Abs) (ID): 21 A

Supporting a maximum drain current of 21 A makes this FET suitable for heavy load applications, ensuring it can efficiently manage power demands.

No. of Terminals: 3

Three terminals simplify design while allowing for effective integration into various circuit configurations.

Maximum Power Dissipation (Abs): 160 W

A high power dissipation capability ensures the transistor can handle substantial power, allowing for effective heat management in high-power applications.

Package Style (Meter): IN-LINE

The in-line package style allows for easy assembly and efficient placement on PCBs, ideal for automated manufacturing processes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high switching speeds and efficiency, making it a good choice for modern electronic designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating allows this FET to function effectively in demanding environments, enhancing its application range.

Transistor Element Material: SILICON

Silicon transistors combine excellent electrical performance with cost-effectiveness, making them widely used in diverse applications.

Maximum Drain Current (ID): 21 A

The ability to continuously handle 21 A ensures this FET can be utilized in various high-power applications with reliability.

Maximum Drain-Source On Resistance: 0.16 ohm

Low on-resistance minimizes power loss during operation, enhancing overall efficiency and thermal management.

Terminal Position: SINGLE

A single terminal position simplifies circuit design, making it easier to incorporate into existing layouts or new designs.

Technical Specifications

Power Field Effect Transistors (FET) STI25NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

21 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI25NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17