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STI21NM60ND

STMicroelectronics

STI21NM60ND by STMicroelectronics

STI21NM60ND by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 68A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,221 parts In-Stock

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4,221

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Anansix

USA . 1,890 parts In-Stock

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1,890

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Digiode

USA . 390 parts In-Stock

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390

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IDEA Electronic Components Group

UK . 1,643 parts In-Stock

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$1.187

100+ parts

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$1.068

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1,643

$1.187

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$1.068

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MKK Technologies

India . 2,018 parts In-Stock

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$2.232

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$2.232

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DigiPath Technology Company

USA . 2,018 parts In-Stock

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$2.232

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2,018

$2.232

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AZTECH Wire

Italy . 1,191 parts In-Stock

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$21.310

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1,191

$21.310

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Corphita

USA . 4,435 parts In-Stock

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4,435

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Alle Elektronik GmbH

Germany . 3,966 parts In-Stock

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Parana Technologies

USA . 476 parts In-Stock

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$1.419

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476

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$1.419

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Overview

Unlock the potential of your designs with the STI21NM60ND from STMicroelectronics, a premier choice in power field effect transistors. Renowned for their exceptional reliability and performance, STMicroelectronics ensures top-notch quality that stands the test of time. Ideal for high-voltage switching applications, this N-channel FET delivers superior efficiency and enhanced thermal management. Elevate your projects with cutting-edge technology that promises durability and compelling value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The PLASTIC/EPOXY body material ensures durability and resistance to environmental factors, making this FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are known for better efficiency and faster switching speeds, making this FET an excellent choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This design simplifies circuit layout and provides flyback protection, enhancing its reliability in switching applications.

Transistor Application: SWITCHING

Optimized for switching applications, this FET offers excellent control over power flow, suitable for various electronic designs.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage of 600 V allows this FET to operate in high-voltage environments, making it ideal for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space usage on PCBs, aiding in compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and make assembly easier, especially for prototyping and rugged applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for better control of the conduction path, leading to improved efficiency in applications requiring high performance.

Maximum Pulsed Drain Current (IDM): 68 A

A high pulsed drain current capability enables handling of transient loads, which is beneficial in power management situations.

Avalanche Energy Rating (EAS): 610 mJ

A high avalanche energy rating indicates robustness against voltage spikes, enhancing reliability and lifespan in demanding conditions.

Maximum Drain Current (Abs) (ID): 17 A

The ability to handle a maximum drain current of 17 A enables this FET to drive various loads effectively, ensuring versatility in applications.

No. of Terminals: 3

With 3 terminals, this FET is straightforward to integrate into various circuit designs, simplifying assembly.

Maximum Power Dissipation (Abs): 140 W

High power dissipation capability allows for efficient heat management, making it suitable for high-performance applications.

Package Style (Meter): IN-LINE

The in-line package style enhances thermal performance and aids in better airflow, improving overall efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high switching speed and low power consumption, which is optimal for modern high-frequency applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliable operation in high-temperature environments, enhancing the FET's performance.

Transistor Element Material: SILICON

Silicon as the material provides reliable electrical properties and excellent performance in various conditions, ensuring durability.

Maximum Drain Current (ID): 17 A

The rated maximum drain current of 17 A ensures reliable operation under significant load conditions, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.22 ohm

Low on-resistance minimizes power losses in the conduction state, enhancing overall efficiency in the circuit.

Terminal Position: SINGLE

Single terminal positioning simplifies integration into circuits, promoting ease of use and flexibility in designs.

Technical Specifications

Power Field Effect Transistors (FET) STI21NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

610 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.22 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI21NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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