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STI270N4F3

STMicroelectronics

STI270N4F3 by STMicroelectronics

STI270N4F3 by STMicroelectronics is a N-CHANNEL FET with 40V DS Breakdown Voltage, 120A ID, and 0.0026 ohm RDS. Ideal for SWITCHING applications due to its 480A IDM and 1000mJ EAS ratings. Operating in ENHANCEMENT MODE, it has a max power dissipation of 330W at 175°C.

Median Price

$5.530

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 883 parts In-Stock

1+ parts

$5.530

100+ parts

$2.646

1k+ parts

$2.201

10k+ parts

-

883

$5.530

$2.646

$2.201

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.785

100+ parts

-

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100

$2.785

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Digiode

USA . 4,084 parts In-Stock

1+ parts

$5.254

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4,084

$5.254

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Vyrian

USA . 5,116 parts In-Stock

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5,116

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Anansix

USA . 1,992 parts In-Stock

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1,992

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Dan-Mar Components

USA . 1,739 parts In-Stock

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1,739

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ACDS - Activité Composants Distribution Service

France . 959 parts In-Stock

1+ parts

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959

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Bristol Electronics

USA . 739 parts In-Stock

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739

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Cyclops Electronics Ltd

UK . 185 parts In-Stock

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185

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 446 parts In-Stock

1+ parts

$0.442

100+ parts

-

1k+ parts

$0.397

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446

$0.442

-

$0.397

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MKK Technologies

India . 1,637 parts In-Stock

1+ parts

$0.830

100+ parts

-

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1,637

$0.830

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DigiPath Technology Company

USA . 1,637 parts In-Stock

1+ parts

$0.830

100+ parts

-

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1,637

$0.830

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$1.624

100+ parts

$1.478

1k+ parts

$1.332

10k+ parts

-

150

$1.624

$1.478

$1.332

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Continental Prestige Electronics

USA . 3,751 parts In-Stock

1+ parts

$2.785

100+ parts

-

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$2.729

3,751

$2.785

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-

$2.729

Argo Parts USA

USA . 2,605 parts In-Stock

1+ parts

$2.785

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2,605

$2.785

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.785

100+ parts

$2.729

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-

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1,000

$2.785

$2.729

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Ampacity Inc.

Singapore . 396 parts In-Stock

1+ parts

$4.700

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396

$4.700

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Corphita

USA . 1,196 parts In-Stock

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$4.977

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1,196

$4.977

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AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$11.954

100+ parts

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883

$11.954

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Microchip USA

USA . 348 parts In-Stock

1+ parts

$28.925

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348

$28.925

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Lixinc

USA . 17,806 parts In-Stock

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17,806

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Alle Elektronik GmbH

Germany . 3,424 parts In-Stock

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Perfect Parts

USA . 2,563 parts In-Stock

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2,563

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Parana Technologies

USA . 2,310 parts In-Stock

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$0.528

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2,310

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$0.528

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Authorized Procurement Solutions

USA . 75 parts In-Stock

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75

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Overview

Unleash the power of innovation with the STI270N4F3 by STMicroelectronics, a top-tier manufacturer known for its cutting-edge technology and superior quality products. As a Power Field Effect Transistor (FET), this single N-CHANNEL transistor with a built-in diode is perfect for switching applications. With a high DS breakdown voltage of 40V and a maximum pulsated drain current of 480A, this transistor offers unrivaled performance and reliability. Whether you're looking to enhance your electronics project or improve efficiency in your systems, the STI270N4F3 delivers exceptional value and benefits to customers seeking top-of-the-line components. Experience the difference with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer better efficiency and reliability compared to P-channel transistors, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and helps protect against reverse current flow, enhancing the overall reliability of the transistor.

Transistor Application: SWITCHING

Designed for switching applications, this transistor provides fast and efficient operation, making it ideal for control circuits and power electronics.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this transistor can withstand higher voltages, ensuring stable operation in high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and space-saving on circuit boards, making it convenient for integration into various designs.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and easy soldering, ensuring reliable performance in industrial and commercial applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control over the transistor's conductivity, improving efficiency and performance in switching applications.

Maximum Pulsed Drain Current (IDM): 480 A

With a high pulsed drain current rating of 480A, this transistor can handle large surge currents, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 1000 mJ

The high avalanche energy rating of 1000mJ ensures reliable operation under high-energy transient conditions, making it robust and durable.

Maximum Drain Current (Abs) (ID): 120 A

The maximum drain current rating of 120A allows for high power handling capabilities, making it suitable for high-current applications.

No. of Terminals: 3

With three terminals, this transistor offers easy connectivity and versatility in circuit designs, making it adaptable to various applications.

Maximum Power Dissipation (Abs): 330 W

The high power dissipation rating of 330W ensures efficient heat dissipation, preventing overheating and ensuring long-term reliability.

Package Style (Meter): IN-LINE

The in-line package style provides a compact and streamlined design, making it easy to install and suitable for tight spaces.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high-performance characteristics, such as low power consumption and fast switching speeds.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this transistor can withstand high-temperature environments, ensuring reliable performance in demanding conditions.

Transistor Element Material: SILICON

Silicon-based transistors offer high reliability, efficiency, and performance, making them a popular choice for a wide range of applications.

Maximum Drain-Source On Resistance: 0.0026 ohm

The low drain-source on resistance of 0.0026 ohm minimizes power loss and improves efficiency, making it ideal for high-current applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and reduces the risk of errors, ensuring easy installation and maintenance.

Case Connection: DRAIN

The drain case connection offers convenient circuit design and simplifies connection to the drain terminal, ensuring reliable performance and efficiency.

Technical Specifications

Power Field Effect Transistors (FET) STI270N4F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI270N4F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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