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STGP8NC60K

STMicroelectronics

STGP8NC60K by STMicroelectronics

STGP8NC60K from STMicroelectronics is an N-channel IGBT designed for power control applications. It features a max collector-emitter voltage of 600 V, a nominal turn-off time of 242 ns, and can handle up to 15 A of collector current. This robust device operates efficiently at temperatures up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 5,254 parts In-Stock

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Anansix

USA . 2,489 parts In-Stock

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2,489

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Digiode

USA . 1,889 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 850 parts In-Stock

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850

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Bristol Electronics

USA . 850 parts In-Stock

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850

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Dan-Mar Components

USA . 850 parts In-Stock

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850

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IDEA Electronic Components Group

UK . 354 parts In-Stock

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$1.774

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$1.596

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354

$1.774

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$1.596

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MKK Technologies

India . 2,137 parts In-Stock

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$3.335

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$3.335

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DigiPath Technology Company

USA . 2,137 parts In-Stock

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$3.335

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$3.335

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AZTECH Wire

Italy . 1,132 parts In-Stock

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$18.910

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$18.910

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Component Stockers USA

USA . 325 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 4,677 parts In-Stock

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Parana Technologies

USA . 2,355 parts In-Stock

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$2.121

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Perfect Parts

USA . 2,001 parts In-Stock

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Overview

Unlock the power of innovation with the STGP8NC60K from STMicroelectronics, a premier choice in Insulated Gate Bipolar Transistors. Renowned for their exceptional quality and reliability, STMicroelectronics delivers unmatched performance in power control applications. This N-channel IGBT ensures efficient operation, with rapid switching times and robust thermal performance. Elevate your projects with a versatile solution that combines efficiency with durability, ideal for industrial automation and renewable energy systems. Experience the difference with STMicroelectronics—where quality meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making the IGBT reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer better electron mobility, resulting in improved efficiency and performance in power control applications.

Configuration: SINGLE

Single configuration simplifies circuit design and minimizes space, which can be advantageous in compact systems.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can handle high voltages and currents, making it suitable for demanding applications.

Package Shape: RECTANGULAR

Rectangular package design promotes ease of mounting and integration into diverse circuit layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide stable connections and facilitate easy soldering, ensuring robust performance in high-stress environments.

Nominal Turn Off Time (toff): 242 ns

Fast turn off time enhances the operational efficiency of the transistor, allowing for quicker response in power electronics.

No. of Terminals: 3

Three terminals offer a straightforward design for connections, simplifying integration into circuits.

Maximum Power Dissipation (Abs): 65 W

With a maximum power dissipation of 65 W, this IGBT is capable of handling substantial power loads, making it suitable for high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure attachment and improved thermal management, enhancing the reliability and performance of the IGBT.

Maximum Operating Temperature: 150 °C

High operating temperature tolerance ensures that the IGBT can function effectively in harsh environments without overheating.

Maximum Collector-Emitter Voltage: 600 V

A maximum voltage rating of 600 V enables the IGBT to handle high voltage applications safely and reliably.

Transistor Element Material: SILICON

Silicon as the semiconductor material provides good thermal stability and performance in switching applications.

Maximum Gate-Emitter Voltage: 20 V

A gate-emitter voltage of 20 V allows for flexibility in drive voltage configurations, accommodating a wide range of control signals.

Maximum Collector Current (IC): 15 A

With a collector current rating of 15 A, this IGBT is suitable for medium to high power applications, enhancing its versatility.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

A lower threshold voltage facilitates easier drive from control circuits, improving efficiency in circuit design.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and prevents oxidation, ensuring reliable electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout and reduces design complexity, which can lower manufacturing costs.

Nominal Turn On Time (ton): 23 ns

Very fast turn on time increases the switching speed of the device, contributing to overall system efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP8NC60K attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

242 ns

Nominal Turn On Time (ton):

23 ns

Trade Compliance

STGP8NC60K Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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