Loading...

STGP35N35LZ

STMicroelectronics

STGP35N35LZ by STMicroelectronics

STGP35N35LZ from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 380V, 40A collector current, and operates at up to 175 °C. Ideal for high-performance switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,518

-

-

-

-

Anansix

USA . 2,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,006

-

-

-

-

Digiode

USA . 161 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

161

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,850 parts In-Stock

1+ parts

$1.549

100+ parts

-

1k+ parts

$1.394

10k+ parts

-

1,850

$1.549

-

$1.394

-

MKK Technologies

India . 379 parts In-Stock

1+ parts

$2.913

100+ parts

-

1k+ parts

-

10k+ parts

-

379

$2.913

-

-

-

DigiPath Technology Company

USA . 379 parts In-Stock

1+ parts

$2.913

100+ parts

-

1k+ parts

-

10k+ parts

-

379

$2.913

-

-

-

AZTECH Wire

Italy . 137 parts In-Stock

1+ parts

$14.990

100+ parts

-

1k+ parts

-

10k+ parts

-

137

$14.990

-

-

-

Perfect Parts

USA . 952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

952

-

-

-

-

Corphita

USA . 624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

624

-

-

-

-

Parana Technologies

USA . 23 parts In-Stock

1+ parts

-

100+ parts

$1.852

1k+ parts

-

10k+ parts

-

23

-

$1.852

-

-

Overview

Elevate your power control solutions with the STGP35N35LZ from STMicroelectronics, a trusted leader in semiconductor technology. This high-performance IGBT combines superior efficiency with robust reliability, perfect for demanding applications such as motor drives and renewable energy systems. With its compact design and built-in diode, it simplifies integration while offering exceptional thermal management. Choose STMicroelectronics for unmatched quality and performance that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliable performance and durability, making this IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel devices are known for their lower on-resistance and higher efficiency, making them ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

This configuration enhances performance by integrating necessary components, reducing the need for additional external parts.

Transistor Application: POWER CONTROL

Designed specifically for power applications, this IGBT excels in high-power delivery, ensuring optimal performance in demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization and ease of assembly in electronic circuits.

Terminal Form: THROUGH-HOLE

Through-hole technology provides robust mechanical connections, enhancing reliability in high-vibration environments.

Nominal Turn Off Time (toff): 37000 ns

A nominal turn off time of 37000 ns enables efficient switching, crucial for high-frequency applications.

No. of Terminals: 3

The simple 3-terminal design facilitates easy integration into various circuits, enhancing versatility.

Maximum Power Dissipation (Abs): 176 W

With a high maximum power dissipation capability, this IGBT can handle intense electrical loads, ensuring reliable operation under stress.

Package Style (Meter): FLANGE MOUNT

Flange mount design simplifies mounting solutions, providing stability and solid connections in physical installations.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows this IGBT to function in extreme environments without compromising performance.

Maximum Collector-Emitter Voltage: 380 V

Supporting a collector-emitter voltage of up to 380 V, this IGBT is suitable for a wide range of high-voltage applications.

Transistor Element Material: SILICON

Silicon is a proven material for high-performance transistors, offering good thermal stability and efficiency.

Maximum Gate-Emitter Voltage: 12 V

The maximum gate-emitter voltage of 12 V permits effective driving capabilities, enhancing operational flexibility.

Maximum Collector Current (IC): 40 A

With a maximum collector current of 40 A, this IGBT can manage heavy electrical loads, reinforcing its application in power systems.

Maximum Gate-Emitter Threshold Voltage: 2.3 V

A low gate-emitter threshold voltage ensures efficient triggering, minimizing power losses during operation.

Terminal Finish: Matte Tin (Sn)

The matte tin finish promotes excellent solderability, ensuring reliable connections and ease of assembly in manufacturing.

Terminal Position: SINGLE

A single terminal position minimizes the complexity of circuit design, making it user-friendly for engineers and designers.

Case Connection: COLLECTOR

Direct collector connection simplifies the circuit design, improving overall efficiency and performance in power applications.

Nominal Turn On Time (ton): 7600 ns

The fast nominal turn on time of 7600 ns allows for quicker response times, which is vital in high-speed switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP35N35LZ attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Additional Features:

VOLTAGE CLAMPING

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

380 V

Maximum Gate-Emitter Threshold Voltage:

2.3 V

Maximum Gate-Emitter Voltage:

12 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

37000 ns

Nominal Turn On Time (ton):

7600 ns

Trade Compliance

STGP35N35LZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20