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STGP10NC60H

STMicroelectronics

STGP10NC60H by STMicroelectronics

STGP10NC60H from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, a power dissipation of 60 W, and fast switching times (ton: 19 ns, toff: 247 ns). Ideal for high-temperature environments with a max operating temp of 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DigiKey

USA . 59 parts In-Stock

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59

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Digiode

USA . 4,262 parts In-Stock

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4,262

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Vyrian

USA . 2,892 parts In-Stock

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Anansix

USA . 1,368 parts In-Stock

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Bristol Electronics

USA . 600 parts In-Stock

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600

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Dan-Mar Components

USA . 600 parts In-Stock

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600

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IDEA Electronic Components Group

UK . 1,996 parts In-Stock

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$1.233

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$1.110

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$1.233

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MKK Technologies

India . 297 parts In-Stock

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$2.318

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DigiPath Technology Company

USA . 297 parts In-Stock

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$2.318

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Microchip USA

USA . 337 parts In-Stock

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$12.740

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Component Stockers USA

USA . 2,065 parts In-Stock

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$28.800

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$28.800

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,353 parts In-Stock

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Parana Technologies

USA . 1,053 parts In-Stock

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$1.474

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Perfect Parts

USA . 293 parts In-Stock

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Overview

Elevate your power control applications with the STGP10NC60H from STMicroelectronics, a leader in semiconductor innovation. This robust IGBT delivers exceptional performance and reliability, making it ideal for demanding environments. With its optimized switching times and superior thermal management, you can achieve greater efficiency and longevity in your designs. Trust STMicroelectronics for quality and innovation that propel your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel devices typically offer better performance and efficiency in switching applications, which enhances overall circuit performance.

Configuration: SINGLE

A single configuration simplifies design and integration into circuits, making it easier for engineers to implement power control solutions.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for applications requiring efficient and reliable switching capabilities.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and better heat dissipation, contributing to improved performance in power applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and reliable connections, beneficial for applications where durability is essential.

Nominal Turn Off Time (toff): 247 ns

A nominal turn-off time of 247 ns signifies quick response times, enhancing the efficiency of power control applications.

No. of Terminals: 3

With three terminals, this IGBT allows for easy connections, simplifying circuit design and improving ease of use in various configurations.

Maximum Power Dissipation (Abs): 60 W

A maximum power dissipation of 60 W indicates the IGBT's ability to handle substantial loads, making it suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides secure fixation on printed circuit boards and aids in heat management, making it ideal for power electronic applications.

Maximum Operating Temperature: 150 °C

Operating at a maximum temperature of 150 °C ensures reliability and performance in harsh conditions, expanding application versatility.

Maximum Collector-Emitter Voltage: 600 V

A collector-emitter voltage rating of 600 V ensures this IGBT can handle high voltage applications, making it suitable for a variety of power systems.

Transistor Element Material: SILICON

Silicon as a material choice provides excellent switching characteristics and thermal performance, contributing to the efficiency of the IGBT.

Maximum Gate-Emitter Voltage: 20 V

The ability to withstand a maximum gate-emitter voltage of 20 V allows for compatibility with standard gate drive circuits, enhancing design flexibility.

Maximum Collector Current (IC): 20 A

A maximum collector current of 20 A ensures suitability for high current applications, making it a robust choice for power electronics.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

The gate-emitter threshold voltage of 5.75 V indicates efficient control at lower voltages, contributing to energy savings in circuit operation.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, ensuring reliable connections and reducing manufacturing complexities.

Terminal Position: SINGLE

A single terminal position simplifies the design and reduces the footprint of the device in circuits, making it a convenient choice for designers.

Nominal Turn On Time (ton): 19 ns

A nominal turn-on time of 19 ns highlights the quick switching capability of this IGBT, making it suitable for high-speed power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP10NC60H attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

247 ns

Nominal Turn On Time (ton):

19 ns

Trade Compliance

STGP10NC60H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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