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STGP10NB60SFP

STMicroelectronics

STGP10NB60SFP by STMicroelectronics

STGP10NB60SFP from STMicroelectronics is a robust N-channel IGBT ideal for motor control applications. It features a max collector-emitter voltage of 600 V, power dissipation of 31.5 W, and operates up to 150 °C. Its through-hole design ensures easy integration in various systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,819 parts In-Stock

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Digiode

USA . 3,041 parts In-Stock

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3,041

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Anansix

USA . 2,629 parts In-Stock

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2,629

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IDEA Electronic Components Group

UK . 947 parts In-Stock

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$1.446

100+ parts

-

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$1.302

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947

$1.446

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$1.302

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$1.597

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$1.453

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$1.310

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70

$1.597

$1.453

$1.310

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MKK Technologies

India . 2,113 parts In-Stock

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$2.720

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DigiPath Technology Company

USA . 2,113 parts In-Stock

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$2.720

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$2.720

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AZTECH Wire

Italy . 793 parts In-Stock

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$14.790

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793

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Lixinc

USA . 12,848 parts In-Stock

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RC Electronics

USA . 7,015 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,843 parts In-Stock

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Corphita

USA . 4,866 parts In-Stock

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Kepictronics

USA . 3,610 parts In-Stock

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Parana Technologies

USA . 1,971 parts In-Stock

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$1.729

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$1.729

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Overview

Unlock unparalleled performance with the STGP10NB60SFP from STMicroelectronics, your go-to solution for motor control applications. Crafted with precision, this N-channel IGBT offers exceptional reliability and efficiency, making it ideal for demanding environments. With a robust design that supports high power dissipation and elevated temperatures, customers can trust in its longevity and superior functionality. Elevate your projects, reduce energy costs, and experience seamless operation with STMicroelectronics’ commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making this IGBT suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer better performance characteristics, such as higher efficiency and speed in switching applications, making them a preferred choice for motor control.

Configuration: SINGLE

A single configuration simplifies the design and layout of circuits, allowing for reduced complexity in applications and easier integration into existing systems.

Transistor Application: MOTOR CONTROL

Designed specifically for motor control applications, this IGBT can handle high power loads efficiently and reliably, enhancing performance in drive systems.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs, making it easier to fit into compact designs without sacrificing performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides excellent mechanical strength and secure mounting, ensuring reliable electrical connections in demanding environments.

No. of Terminals: 3

With three terminals, this IGBT allows for straightforward connection and simplifies the control circuit design for various applications.

Maximum Power Dissipation (Abs): 31.5 W

A maximum power dissipation capability of 31.5 W ensures that the IGBT can handle the required power levels without overheating, improving reliability.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides robust physical stability, which is essential for high-power applications, enhancing the IGBT's longevity and performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows the IGBT to function effectively in demanding thermal environments, expanding its application range.

Maximum Collector-Emitter Voltage: 600 V

With a collector-emitter voltage rating of 600 V, this IGBT is well-suited for high-voltage applications, providing versatility in design.

Transistor Element Material: SILICON

Silicon as the transistor element material ensures excellent thermal performance and superior electrical characteristics, enhancing overall efficiency.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V allows for flexible drive circuit designs while ensuring effective control over the IGBT operation.

Maximum Collector Current (IC): 20 A

The ability to handle a maximum collector current of 20 A makes this IGBT suitable for high current applications, ensuring reliable operation in motor drives.

Maximum Gate-Emitter Threshold Voltage: 5 V

A threshold voltage of 5 V minimizes the power required to turn the transistor on, enhancing efficiency in control circuits.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures reliable electrical contact, enhancing the longevity of connections.

Terminal Position: SINGLE

Single terminal position helps in straightforward integration into circuits, contributing to ease of assembly and reducing space requirements on PCB.

Case Connection: ISOLATED

Isolated case connection is essential for safety in high-voltage applications, adding an extra layer of reliability and reducing risks of shorts.

Nominal Turn On Time (ton): 1160 ns

With a turn on time of 1160 ns, this IGBT provides fast switching capabilities, making it ideal for high-speed applications in motor control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP10NB60SFP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn On Time (ton):

1160 ns

Trade Compliance

STGP10NB60SFP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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