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STGDL6NC60DIT4

STMicroelectronics

STGDL6NC60DIT4 by STMicroelectronics

STGDL6NC60DIT4 by STMicroelectronics is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 13A max collector current, and 50W max power dissipation. Ideal for power control applications due to its fast turn-off time of 122ns and built-in diode configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,116 parts In-Stock

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5,116

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Anansix

USA . 2,899 parts In-Stock

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2,899

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Digiode

USA . 1,795 parts In-Stock

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1,795

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,266 parts In-Stock

1+ parts

$0.603

100+ parts

-

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$0.542

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2,266

$0.603

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$0.542

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MKK Technologies

India . 1,016 parts In-Stock

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$1.133

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1,016

$1.133

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DigiPath Technology Company

USA . 1,016 parts In-Stock

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$1.133

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1,016

$1.133

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AZTECH Wire

Italy . 752 parts In-Stock

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$12.870

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752

$12.870

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Perfect Parts

USA . 27,247 parts In-Stock

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27,247

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Parana Technologies

USA . 1,193 parts In-Stock

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$0.720

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1,193

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$0.720

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Corphita

USA . 262 parts In-Stock

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262

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Overview

Discover the STGDL6NC60DIT4 by STMicroelectronics, a high-quality Insulated Gate Bipolar Transistor designed for power control applications. With a single configuration and built-in diode, this N-CHANNEL transistor offers reliable performance and efficient power dissipation. Ideal for surface mount installations, this product boasts a fast turn-off time of 122 ns and a maximum operating temperature of 150 °C. Trust in STMicroelectronics for cutting-edge technology and superior products that deliver value and benefits to customers across various industries.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space on the PCB.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable performance in high-power systems.

Surface Mount: YES

Surface mount technology makes it easier to assemble and allows for high-density PCB designs.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space on the PCB.

Nominal Turn Off Time (toff): 122 ns

Fast turn-off time ensures quick switching speeds and reduces power losses.

No. of Terminals: 2

Having only 2 terminals simplifies the connection and integration into the circuit.

Maximum Power Dissipation (Abs): 50 W

With a high power dissipation rating, this IGBT can handle high power applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact designs.

Maximum Operating Temperature: 150 °C

Operating temperature up to 150 °C ensures reliable performance in high-temperature environments.

Maximum Collector-Emitter Voltage: 600 V

With a high voltage rating, this IGBT can be used in high voltage applications.

Transistor Element Material: SILICON

Silicon material ensures high switching speeds and low on-state voltage drop.

Maximum Gate-Emitter Voltage: 20 V

Having a high gate-emitter voltage rating provides robust protection against voltage spikes.

Maximum Collector Current (IC): 13 A

With a high collector current rating, this IGBT can handle high current loads.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

Low gate-emitter threshold voltage ensures easy gate control and efficient switching.

Terminal Position: SINGLE

Single terminal position simplifies the connection and ensures proper alignment during assembly.

Nominal Turn On Time (ton): 10.5 ns

Fast turn-on time allows for quick response and efficient power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGDL6NC60DIT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

122 ns

Nominal Turn On Time (ton):

10.5 ns

Trade Compliance

STGDL6NC60DIT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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