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STA508

STMicroelectronics

STA508 by STMicroelectronics

STA508 by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 36V and supports up to 6A output current. It operates in extreme temps from -40 °C to 90 °C, ensuring reliability in industrial applications. Built-in thermal and under-voltage protections enhance safety.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,496 parts In-Stock

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6,496

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Digiode

USA . 4,346 parts In-Stock

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4,346

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Anansix

USA . 946 parts In-Stock

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946

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ACDS - Activité Composants Distribution Service

France . 31 parts In-Stock

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31

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Bristol Electronics

USA . 31 parts In-Stock

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31

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Dan-Mar Components

USA . 31 parts In-Stock

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31

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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20

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Distributors (Availability)

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Component Stockers USA

USA . 1,205 parts In-Stock

1+ parts

$1.550

100+ parts

$1.470

1k+ parts

$1.420

10k+ parts

-

1,205

$1.550

$1.470

$1.420

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IDEA Electronic Components Group

UK . 1,083 parts In-Stock

1+ parts

$4.077

100+ parts

-

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$3.670

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-

1,083

$4.077

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$3.670

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Microchip USA

USA . 143 parts In-Stock

1+ parts

$6.668

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-

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143

$6.668

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MKK Technologies

India . 851 parts In-Stock

1+ parts

$7.667

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-

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851

$7.667

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DigiPath Technology Company

USA . 851 parts In-Stock

1+ parts

$7.667

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851

$7.667

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AZTECH Wire

Italy . 956 parts In-Stock

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$19.060

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956

$19.060

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Kepictronics

USA . 37,388 parts In-Stock

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RC Electronics

USA . 32,900 parts In-Stock

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Authorized Procurement Solutions

USA . 18,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,939 parts In-Stock

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6,939

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Corphita

USA . 3,268 parts In-Stock

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3,268

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Parana Technologies

USA . 2,093 parts In-Stock

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$4.875

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2,093

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$4.875

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Vigor

Singapore . 1,898 parts In-Stock

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1,898

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Elevate your designs with the STA508 from STMicroelectronics, a top-tier solution in peripheral drivers. Crafted for reliability and performance, this compact powerhouse operates seamlessly across various applications, ensuring optimal efficiency. With robust thermal and undervoltage protections, it delivers peace of mind while enhancing functionality. Trust in STMicroelectronics' legacy of innovation to unlock new possibilities and boost your projects' success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various applications, making it suitable for industrial use.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of integration into modern printed circuit boards (PCBs).

Maximum Supply Voltage: 36 V

The ability to handle up to 36 V makes this driver versatile for a wide range of peripheral applications.

No. of Functions: 4

The inclusion of multiple functions allows for greater flexibility and efficiency in controlling various peripherals.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier routing on the PCB and space optimization in design.

Built-in Protections: THERMAL; UNDER VOLTAGE

Built-in protections enhance reliability by preventing damage due to overheating and low voltage conditions.

No. of Terminals: 36

A higher number of terminals allows for more connections and functionalities within a single device, enhancing performance.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This style is suitable for compact PCB layouts, saving space while maintaining performance.

Minimum Supply Voltage: 10 V

A low minimum supply voltage requirement enables compatibility with a variety of power systems.

Maximum Operating Temperature: 90 °C

High-temperature tolerance ensures reliability in demanding environments typical in industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures expands usage in extreme and outdoor conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish offers excellent solderability and corrosion resistance, which boosts reliability.

Terminal Position: DUAL

Dual terminal positions provide flexible mounting and connection options for better layout adaptability.

Maximum Seated Height: 3.43 mm

A low seated height helps in maintaining a slim profile for space-constrained modules.

Width: 11 mm

Compact width allows for effective use of board space, suitable for high-density applications.

Maximum Time At Peak Reflow Temperature (s): 30

This parameter ensures the product withstands reflow soldering processes typically used in PCB assembly.

Peak Reflow Temperature °C: 245

The peak reflow temperature ensures compatibility with common soldering technologies.

Length: 15.9 mm

Short length aids in fitting within tight spaces on PCBs, especially in compact designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature support ensures reliability in various challenging environments.

Technology: BCD

The BCD technology results in efficient, reliable operation, making it excellent for power management in peripherals.

Terminal Form: GULL WING

Gull wing terminals provide improved solderability and mechanical strength, lowering connection failures.

Nominal Supply Voltage: 30 V

Providing a nominal operating voltage of 30 V ensures efficient performance across various loading conditions.

Turn-on Time: 0.1 us

Fast turn-on times allow for rapid response in dynamic applications, increasing overall efficiency.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch is suitable for modern PCB designs, facilitating effective layout and connection.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates appropriate handling and storage conditions, ensuring product integrity until use.

Nominal Output Peak Current Limit: 6 A

The high output peak current limit supports demanding applications needing robust performance.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge design allows for effective control of peripheral devices, enhancing system performance.

Turn-off Time: 0.1 us

Fast turn-off times increase reliability and responsiveness in critical applications.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current provides versatility in driving different types of loads.

Technical Specifications

Peripheral Drivers STA508 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

30 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

11 mm

Trade Compliance

STA508 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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