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STA506A

STMicroelectronics

STA506A by STMicroelectronics

STA506A by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 36V and supports up to 6A output current. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for automotive and industrial applications, it operates b/w 0 °C to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,480 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,480

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-

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Digiode

USA . 1,697 parts In-Stock

1+ parts

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-

1k+ parts

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1,697

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Anansix

USA . 897 parts In-Stock

1+ parts

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100+ parts

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897

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,372 parts In-Stock

1+ parts

$12.417

100+ parts

-

1k+ parts

$11.176

10k+ parts

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1,372

$12.417

-

$11.176

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MKK Technologies

India . 1,775 parts In-Stock

1+ parts

$23.350

100+ parts

-

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10k+ parts

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1,775

$23.350

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DigiPath Technology Company

USA . 1,775 parts In-Stock

1+ parts

$23.350

100+ parts

-

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1,775

$23.350

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Corphita

USA . 3,552 parts In-Stock

1+ parts

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3,552

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A-Z Elektronik GmbH

Germany . 1,125 parts In-Stock

1+ parts

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100+ parts

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1,125

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Parana Technologies

USA . 1,118 parts In-Stock

1+ parts

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100+ parts

$14.847

1k+ parts

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1,118

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$14.847

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Overview

Unlock exceptional performance with the STA506A from STMicroelectronics, a premier choice in peripheral drivers. Designed for reliability, its advanced protection features ensure safe operation across various applications, from automotive to industrial automation. With a compact design and robust capabilities, it delivers efficiency and power management that elevate your projects. Trust in STMicroelectronics’ legacy of quality to drive innovation and enhance your product's value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and longevity of the peripheral driver in various operating conditions.

Surface Mount: YES

Easy to integrate into compact designs, making it suitable for modern, space-constrained applications.

Maximum Supply Voltage: 36 V

Allows for high-voltage applications, increasing its versatility across different electronic systems.

No. of Functions: 4

Multiple functions streamline circuit design and reduce the need for additional components, saving space and cost.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient layout and placement on PCBs, optimizing space.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections enhance safety and reliability during operation, preventing damage to the driver and connected components.

No. of Terminals: 36

Ample terminals support complex configurations and connections, making it highly adaptable for various applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Compact design allows for efficient thermal management while fitting into tighter spaces.

Minimum Supply Voltage: 9 V

Ability to operate at lower voltages expands its usability in different power conditions, enhancing flexibility.

Maximum Operating Temperature: 70 °C

Higher temperature range ensures stability and performance in demanding environments.

Minimum Operating Temperature: 0 °C

Allows operation in cooler environments, making it versatile for various climates.

Terminal Position: DUAL

Dual terminal position helps in simplifying manufacturing and assembly processes.

Maximum Seated Height: 3.43 mm

Low height contributes to compact designs and minimizes the product's footprint on PCBs.

Width: 11 mm

Narrow width aids in high-density component placement, facilitating efficient layout.

Peak Reflow Temperature °C: 245

Compatible with standard soldering processes, ensuring easy integration into existing manufacturing workflows.

Length: 15.7 mm

Compact length is suitable for a variety of circuit layouts, maintaining flexibility in design.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliability in various consumer and industrial applications.

Technology: BCD

BCD technology enhances performance and efficiency, allowing for better management of power dissipation.

Terminal Form: GULL WING

Gull wing terminals provide a secure connection and ease of soldering for reliable performance.

Nominal Supply Voltage: 30 V

Optimized supply voltage allows for enhanced efficiency and performance across applications.

Turn-on Time: 0.1 us

Fast turn-on time increases responsiveness in applications, improving overall system performance.

Terminal Pitch: 0.65 mm

Fine pitch enables higher density layouts, giving designers flexibility in PCB design.

Nominal Output Peak Current Limit: 6 A

High current capability strengthens its application in power-demanding environments, making it suitable for motor drives or similar applications.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge configuration enhances the driver's ability to control motors and actuators effectively.

Turn-off Time: 0.1 us

Rapid turn-off time minimizes power loss and improves overall efficiency in switching applications.

Output Current Flow Direction: SOURCE AND SINK

Dual direction of current flow provides enhanced flexibility in application designs, allowing for diverse usage scenarios.

Technical Specifications

Peripheral Drivers STA506A attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

Length:

15.7 mm

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

9 V

Nominal Supply Voltage:

30 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

11 mm

Trade Compliance

STA506A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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