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STA505

STMicroelectronics

STA505 by STMicroelectronics

STA505 by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 36V and operates in -40 °C to 90 °C. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for industrial applications, it supports up to 6A output current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,941 parts In-Stock

1+ parts

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6,941

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Digiode

USA . 3,431 parts In-Stock

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3,431

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Anansix

USA . 2,485 parts In-Stock

1+ parts

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2,485

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 193 parts In-Stock

1+ parts

$5.346

100+ parts

-

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-

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193

$5.346

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IDEA Electronic Components Group

UK . 138 parts In-Stock

1+ parts

$9.171

100+ parts

-

1k+ parts

$8.254

10k+ parts

-

138

$9.171

-

$8.254

-

AZTECH Wire

Italy . 1,092 parts In-Stock

1+ parts

$11.150

100+ parts

-

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-

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1,092

$11.150

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-

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MKK Technologies

India . 1,516 parts In-Stock

1+ parts

$17.245

100+ parts

-

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1,516

$17.245

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DigiPath Technology Company

USA . 1,516 parts In-Stock

1+ parts

$17.245

100+ parts

-

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-

10k+ parts

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1,516

$17.245

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-

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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15,000

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Kepictronics

USA . 10,566 parts In-Stock

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10,566

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A-Z Elektronik GmbH

Germany . 6,122 parts In-Stock

1+ parts

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6,122

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Vigor

Singapore . 4,407 parts In-Stock

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4,407

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Corphita

USA . 1,730 parts In-Stock

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1,730

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Parana Technologies

USA . 1,113 parts In-Stock

1+ parts

-

100+ parts

$10.965

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1,113

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$10.965

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Overview

Elevate your designs with the STA505 from STMicroelectronics—a trusted leader in innovation and quality. This robust peripheral driver seamlessly manages multiple functions while ensuring safety with built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for a wide range of industrial applications, the STA505's compact design and reliable performance empower engineers to push boundaries and deliver superior solutions effortlessly. Experience unparalleled efficiency and peace of mind with every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and longevity in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern circuit boards, enhancing manufacturing efficiency.

Maximum Supply Voltage: 36 V

A high maximum supply voltage enables the driver to be used in a wide range of applications, accommodating diverse power needs.

No. of Functions: 4

With four functions, this peripheral driver offers versatility, enabling it to drive multiple loads and enhance design flexibility.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for efficient PCB layout and space-saving in design, making it an excellent choice for compact applications.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections provide enhanced reliability and safety, reducing the risk of damage and failure in the circuit.

No. of Terminals: 36

The presence of 36 terminals allows for extensive connectivity options, facilitating versatile applications and improving circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style provides efficient thermal management and a compact footprint, catering to high-performance applications.

Minimum Supply Voltage: 10 V

A low minimum supply voltage expands the range of compatible systems, making it suitable for low-voltage applications.

Maximum Operating Temperature: 90 °C

The driver can operate at high temperatures, making it suitable for use in demanding environments and applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this driver is suitable for harsh environments, ensuring reliability in extreme conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for flexible placement on the PCB, aiding in design and assembly efficiency.

Maximum Seated Height: 3.43 mm

A low seated height contributes to a compact design, fitting easily into space-constrained applications.

Width: 11 mm

A narrow width allows for space-efficient designs on PCBs, supporting a range of applications.

Length: 15.9 mm

The compact length of this driver aids in reducing the overall footprint of the circuit, ideal for compact devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees reliable operation in a wide range of environmental conditions.

Technology: BCD

BCD technology enhances performance and efficiency, making this driver suitable for advanced applications.

Terminal Form: GULL WING

Gull-wing terminal form facilitates easy soldering and assembly, reducing manufacturing complexity.

Nominal Supply Voltage: 30 V

A nominal supply voltage of 30 V provides stable operation under normal conditions, ensuring performance reliability.

Turn-on Time: 0.1 us

Fast turn-on time ensures quick response in applications, enhancing the overall performance of the connected systems.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is compatible with modern PCB designs, facilitating efficient layout and assembly.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate moisture sensitivity, allowing for suitable handling and storage practices in manufacturing.

Nominal Output Peak Current Limit: 6 A

A 6 A peak current capability allows the driver to handle significant loads, providing flexibility for various applications.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Being a half-bridge driver, it efficiently controls inductive loads and enhances overall system performance.

Turn-off Time: 0.1 us

Quick turn-off time contributes to high-frequency performance in applications, making it ideal for dynamic systems.

Output Current Flow Direction: SOURCE AND SINK

Bidirectional current flow allows for more versatile applications, supporting complex system designs.

Technical Specifications

Peripheral Drivers STA505 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

30 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

11 mm

Trade Compliance

STA505 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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