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STA501013TR

STMicroelectronics

STA501013TR by STMicroelectronics

STA501013TR by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 36V and operates b/w 10V to 30V. It features thermal and under-voltage protections, ensuring reliable performance in commercial applications. With a compact design, it supports output currents up to 6A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,509 parts In-Stock

1+ parts

-

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1k+ parts

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11,509

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Digiode

USA . 3,994 parts In-Stock

1+ parts

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3,994

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Anansix

USA . 1,152 parts In-Stock

1+ parts

-

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1,152

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Lakeland Logistics Inc

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

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600

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Bristol Electronics

USA . 600 parts In-Stock

1+ parts

-

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600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 272 parts In-Stock

1+ parts

$9.485

100+ parts

-

1k+ parts

-

10k+ parts

-

272

$9.485

-

-

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IDEA Electronic Components Group

UK . 1,619 parts In-Stock

1+ parts

$13.334

100+ parts

-

1k+ parts

$12.001

10k+ parts

-

1,619

$13.334

-

$12.001

-

AZTECH Wire

Italy . 509 parts In-Stock

1+ parts

$16.830

100+ parts

-

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-

10k+ parts

-

509

$16.830

-

-

-

MKK Technologies

India . 467 parts In-Stock

1+ parts

$25.075

100+ parts

-

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467

$25.075

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DigiPath Technology Company

USA . 467 parts In-Stock

1+ parts

$25.075

100+ parts

-

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-

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467

$25.075

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Component Stockers USA

USA . 771 parts In-Stock

1+ parts

$99.990

100+ parts

-

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771

$99.990

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A-Z Elektronik GmbH

Germany . 5,319 parts In-Stock

1+ parts

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5,319

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Vigor

Singapore . 4,453 parts In-Stock

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4,453

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Kepictronics

USA . 4,092 parts In-Stock

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4,092

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Assy Fe

Spain . 4,092 parts In-Stock

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4,092

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Corphita

USA . 2,851 parts In-Stock

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2,851

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Parana Technologies

USA . 378 parts In-Stock

1+ parts

-

100+ parts

$15.943

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10k+ parts

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378

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$15.943

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-

Overview

Unlock superior performance with the STA501013TR from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced peripheral driver ensures reliability and efficiency in diverse applications, from industrial automation to consumer electronics. With built-in thermal and under-voltage protections, it minimizes risks while maximizing output. Experience peace of mind and exceptional value as you elevate your projects with proven quality and cutting-edge technology from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and thermal stability of the component, making it suitable for various environments.

Surface Mount: YES

Surface mount design allows for efficient use of PCB space and simplifies assembly processes, making it easier to integrate into modern electronic systems.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this peripheral driver can handle more demanding applications, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular shape aids in uniform alignment and mounting on circuit boards, ensuring reliable performance in compact setups.

Built-in Protections: THERMAL; UNDER VOLTAGE

These built-in protections safeguard the device from adverse operating conditions, enhancing reliability and lifespan.

No. of Terminals: 36

Having 36 terminals allows for more connections and functionalities, supporting complex circuit designs.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline with shrink pitch enables tight spacing on the PCB, which is essential for high-density applications.

Minimum Supply Voltage: 10 V

A low minimum supply voltage ensures compatibility with a variety of power supply options, making it versatile for diverse applications.

Maximum Operating Temperature: 70 °C

Capability to operate at a maximum temperature of 70 °C suggests robustness and reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C allows for usage in cooler environments, which is critical for outdoor and unheated locations.

Terminal Position: DUAL

Dual terminal positioning is advantageous for routing signals and power effectively, optimizing circuit layouts.

Maximum Seated Height: 3.5 mm

The low seated height supports the design of slimmer devices, appealing for modern, compact electronic designs.

Width: 11 mm

An 11 mm width provides a balance between compactness and functionality, making it easier to place on a crowded board.

Length: 15.9 mm

The specific length ensures compatibility with various board layouts and enhances the overall footprint design flexibility.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates reliability for standard applications, suitable for consumer and industrial products.

Technology: BCDMOS

BCDMOS technology combines analog and digital technologies, contributing to improved performance and integration possibilities.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering processes and improves mechanical stability on the PCB.

Nominal Supply Voltage: 30 V

A nominal supply voltage of 30 V indicates suitability for mid-range applications, striking a good balance between power requirements and efficiency.

Turn-on Time: 100 us

A quick turn-on time enhances responsiveness in dynamic applications, which is crucial for time-sensitive systems.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch supports high-density designs while maintaining ease of handling and soldering.

Nominal Output Peak Current Limit: 6 A

The ability to handle a nominal output peak current of 6 A allows the driver to power demanding loads effectively.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Being a half-bridge type means it can efficiently manage both directions of current flow, crucial for many motor control applications.

Turn-off Time: 100 us

A fast turn-off time contributes to overall system efficiency and enhances control in high-speed applications.

Output Current Flow Direction: SOURCE AND SINK

The capability for both source and sink current flow allows for greater flexibility in circuit design and application versatility.

Technical Specifications

Peripheral Drivers STA501013TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

30 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

100 us

Turn-on Time:

100 us

Width:

11 mm

Trade Compliance

STA501013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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