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STA501

STMicroelectronics

STA501 by STMicroelectronics

STA501 by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 36V and operates b/w 0 °C to 70 °C. It features built-in thermal and under-voltage protections, making it ideal for robust applications. With a nominal output peak current limit of 6A, it's perfect for driving motors and other inductive loads.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,297 parts In-Stock

1+ parts

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3,297

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Vyrian

USA . 3,292 parts In-Stock

1+ parts

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3,292

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Anansix

USA . 2,023 parts In-Stock

1+ parts

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2,023

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 130 parts In-Stock

1+ parts

$7.662

100+ parts

-

1k+ parts

$6.896

10k+ parts

-

130

$7.662

-

$6.896

-

MKK Technologies

India . 2,032 parts In-Stock

1+ parts

$14.407

100+ parts

-

1k+ parts

-

10k+ parts

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2,032

$14.407

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DigiPath Technology Company

USA . 2,032 parts In-Stock

1+ parts

$14.407

100+ parts

-

1k+ parts

-

10k+ parts

-

2,032

$14.407

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A-Z Elektronik GmbH

Germany . 6,918 parts In-Stock

1+ parts

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6,918

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Corphita

USA . 3,604 parts In-Stock

1+ parts

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3,604

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,100 parts In-Stock

1+ parts

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100+ parts

$9.161

1k+ parts

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1,100

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$9.161

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Kepictronics

USA . 664 parts In-Stock

1+ parts

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664

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Overview

Unlock a world of reliability and performance with the STA501 by STMicroelectronics. Designed for robust peripheral driving, this compact powerhouse excels in demanding applications, offering built-in thermal and under-voltage protections for peace of mind. With its superior quality and innovative BCDMOS technology, you're guaranteed efficiency and longevity. Elevate your projects with the STA501—where excellence meets versatility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for varied application scenarios.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on PCBs, facilitating compact designs in modern electronics.

Maximum Supply Voltage: 36 V

A high maximum supply voltage enhances flexibility, accommodating a wide range of applications and ensuring robustness in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape contributes to easier PCB layout and optimized space management for compact electronic designs.

Built-in Protections: THERMAL; UNDER VOLTAGE

Integrated thermal and undervoltage protections ensure reliability and safety, reducing the risk of damage in case of supply issues.

No. of Terminals: 36

With 36 terminals, this driver can support complex connections and functionalities, making it versatile for various peripheral applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline design with a shrink pitch allows for high-density mounting, which is essential for modern electronic applications where space is at a premium.

Minimum Supply Voltage: 10 V

The minimum supply voltage requirement allows this driver to operate in lower-voltage environments, providing more flexibility in design.

Maximum Operating Temperature: 70 °C

Rated for up to 70 °C, this product is suitable for operation in higher temperature environments, ensuring reliability.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this driver can function well in standard environmental conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and improves performance, resulting in reliable electrical connections and longevity.

Terminal Position: DUAL

The dual terminal position design allows for easier integration into PCB designs, improving layout options for engineers.

Maximum Seated Height: 3.5 mm

A low maximum seated height is advantageous for applications requiring a slim profile, enabling designs that fit into tight spaces.

Width: 11 mm

With a width of 11 mm, this product maintains a compact footprint while providing ample terminal connectivity.

Length: 15.9 mm

The length of 15.9 mm allows for efficient use of board space, making it an ideal choice for dense circuit designs.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature conditions indicates its suitability for a wide range of standard industrial and consumer applications.

Technology: BCDMOS

The BCDMOS technology enhances performance and reduces power consumption, which is critical for efficient peripheral driver operations.

Terminal Form: GULL WING

Gull-wing terminals provide reliable surface mount connections, ensuring stable performance during operation.

Nominal Supply Voltage: 30 V

The nominal supply voltage of 30 V provides ideal operating conditions for various applications, enhancing system performance.

Turn-on Time: 100 us

A fast turn-on time of 100 microseconds enables rapid responsiveness in applications, improving overall system efficiency.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for efficient PCB designs, enabling tighter layouts while maintaining reliable connections.

Nominal Output Peak Current Limit: 6 A

A peak current limit of 6 A supports the operation of high-power peripherals, making it a robust choice for demanding applications.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

As a half-bridge based driver, it enables efficient control of motor and other loads, making it suitable for a wide range of applications.

Turn-off Time: 100 us

The 100 microseconds turn-off time allows for quick deactivation of outputs, enhancing performance in switching applications.

Output Current Flow Direction: SOURCE AND SINK

With the capability to source and sink current, this driver provides flexible control of connected devices, improving functionality in various systems.

Technical Specifications

Peripheral Drivers STA501 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

30 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

100 us

Turn-on Time:

100 us

Width:

11 mm

Trade Compliance

STA501 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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