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STA506

STMicroelectronics

STA506 by STMicroelectronics

STA506 by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 36V and supports up to 6A output current. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for applications requiring robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,119 parts In-Stock

1+ parts

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2,119

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Anansix

USA . 468 parts In-Stock

1+ parts

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468

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Vyrian

USA . 410 parts In-Stock

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410

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 916 parts In-Stock

1+ parts

$3.776

100+ parts

-

1k+ parts

$3.398

10k+ parts

-

916

$3.776

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$3.398

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MKK Technologies

India . 2,176 parts In-Stock

1+ parts

$7.100

100+ parts

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2,176

$7.100

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DigiPath Technology Company

USA . 2,176 parts In-Stock

1+ parts

$7.100

100+ parts

-

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2,176

$7.100

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Authorized Procurement Solutions

USA . 34,500 parts In-Stock

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34,500

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A-Z Elektronik GmbH

Germany . 4,779 parts In-Stock

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4,779

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Corphita

USA . 2,018 parts In-Stock

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2,018

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Parana Technologies

USA . 1,164 parts In-Stock

1+ parts

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100+ parts

$4.514

1k+ parts

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1,164

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$4.514

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Kepictronics

USA . 179 parts In-Stock

1+ parts

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179

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Assy Fe

Spain . 25 parts In-Stock

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25

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Overview

Unlock the power of precision and reliability with the STA506 by STMicroelectronics, a premier choice for your peripheral driver needs. Renowned for its superior quality and robust design, this versatile device excels in countless applications, from automotive to industrial automation. With built-in protections against overcurrent, thermal issues, and undervoltage, the STA506 ensures optimal performance and safety, delivering exceptional value and peace of mind for manufacturers and engineers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this peripheral driver reliable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronic devices.

Maximum Supply Voltage: 36 V

A maximum supply voltage of 36 V means this peripheral driver can handle substantial power requirements, making it suitable for a wide range of applications.

No. of Functions: 4

Having four functions enhances versatility, allowing the driver to be used in diverse applications without needing multiple components.

Package Shape: RECTANGULAR

The rectangular shape of the package provides an efficient use of board space, facilitating better layout designs.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections ensure the device maintains operational safety and longevity, which is crucial for managing high-stress applications.

No. of Terminals: 36

With 36 terminals, the product design allows for numerous connectivity options, enhancing flexibility in circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style optimizes thermal performance and space, making it suitable for high-density applications.

Minimum Supply Voltage: 10 V

A minimum supply voltage of 10 V allows the peripheral driver to operate effectively across a wide voltage range.

Maximum Operating Temperature: 70 °C

The capability to operate at temperatures up to 70 °C means the device can function effectively in harsh environments.

Minimum Operating Temperature: 0 °C

Starting operation at 0 °C provides flexibility in various applications, including those in colder climates.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and improves the reliability of electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for various layout configurations, making integration into circuitry simpler.

Maximum Seated Height: 3.43 mm

The low seated height of 3.43 mm is advantageous for maintaining a compact design, making it ideal for space-constrained applications.

Width: 11 mm

With a width of only 11 mm, this driver is well-suited for space-limited designs.

Length: 15.9 mm

The length of 15.9 mm ensures compatibility with various circuit board layouts while maximizing performance.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges means it can reliably operate in standard consumer and industrial environments.

Technology: BCD

BCD technology enhances performance and efficiency, making this peripheral driver a modern solution for high-performance applications.

Terminal Form: GULL WING

The gull wing terminal form provides excellent alignment and strength, ensuring reliable solder joints.

Nominal Supply Voltage: 32 V

With a nominal supply voltage of 32 V, this driver is optimized for high-performance applications requiring substantial power.

Turn-on Time: 0.1 us

A fast turn-on time of 0.1 µs enhances the responsiveness of circuits, making it well-suited for high-speed applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch enhances design flexibility, allowing for compact positioning on the PCB.

Nominal Output Peak Current Limit: 6 A

With a peak current limit of 6 A, this device supports robust load handling, suitable for high-demand applications.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

A half bridge configuration allows for efficient control of motors and other inductive loads, making it ideal for motor driver applications.

Turn-off Time: 0.1 us

A short turn-off time of 0.1 µs ensures minimal delay in circuit operation, contributing to overall system efficiency.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current enhances versatility, allowing this driver to be used in a wide range of applications.

Technical Specifications

Peripheral Drivers STA506 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

32 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

11 mm

Trade Compliance

STA506 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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