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STA500

STMicroelectronics

STA500 by STMicroelectronics

STA500 by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 40V and supports up to 6A output current. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it operates b/w 0 °C to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,312 parts In-Stock

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11,312

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Digiode

USA . 2,121 parts In-Stock

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2,121

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Anansix

USA . 815 parts In-Stock

1+ parts

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815

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Pegasus Components GmbH

Germany . 250 parts In-Stock

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250

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ACDS - Activité Composants Distribution Service

France . 196 parts In-Stock

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196

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ComSIT Distribution GmbH

Germany . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,329 parts In-Stock

1+ parts

$8.911

100+ parts

-

1k+ parts

$8.020

10k+ parts

-

1,329

$8.911

-

$8.020

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AZTECH Wire

Italy . 1,008 parts In-Stock

1+ parts

$14.410

100+ parts

-

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1,008

$14.410

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MKK Technologies

India . 1,213 parts In-Stock

1+ parts

$16.757

100+ parts

-

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1,213

$16.757

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DigiPath Technology Company

USA . 1,213 parts In-Stock

1+ parts

$16.757

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-

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1,213

$16.757

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QUARKTWIN TECHNOLOGY LTD

USA . 28,342 parts In-Stock

1+ parts

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28,342

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Microchip USA

USA . 6,288 parts In-Stock

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6,288

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Vigor

Singapore . 6,257 parts In-Stock

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6,257

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Metaverse IC Inc.

Canada . 5,240 parts In-Stock

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5,240

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A-Z Elektronik GmbH

Germany . 4,919 parts In-Stock

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4,919

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Corphita

USA . 2,778 parts In-Stock

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2,778

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Parana Technologies

USA . 1,024 parts In-Stock

1+ parts

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100+ parts

$10.655

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1,024

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$10.655

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 660 parts In-Stock

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660

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Overview

Elevate your designs with the STA500 from STMicroelectronics—a robust peripheral driver engineered for reliability and performance. With built-in protections against transients, overvoltage, and thermal issues, it ensures safety without compromising efficiency. Ideal for industrial applications, its compact design fits seamlessly into various systems. Trust in STMicroelectronics’ legacy of innovation to deliver unmatched value and dependable solutions that enhance your product’s capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and resistance to environmental factors, making the peripheral driver reliable for long-term applications.

Surface Mount: YES

Surface mount capability allows for easier and more compact PCB designs, facilitating efficient space utilization in electronic devices.

Maximum Supply Voltage: 40 V

A high maximum supply voltage ensures versatility in different applications, accommodating a wide range of electronic systems.

No. of Functions: 4

With four functions, this driver provides multiple functionalities in a single package, reducing component count and simplifying design.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and aligns with common PCB layouts for easier integration.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protection features enhance the reliability of the driver by safeguarding it against various fault conditions.

No. of Terminals: 36

A higher terminal count increases the connectivity options, making it suitable for complex applications requiring multiple interconnections.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design enable high density on PCBs, which is essential for modern compact electronic devices.

Minimum Supply Voltage: 9 V

The minimum supply voltage allows for flexibility in operating environments, supporting various power supply standards.

Maximum Operating Temperature: 70 °C

The capability to operate at elevated temperatures ensures reliability in demanding applications, such as automotive or industrial settings.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures functionality in a wide range of environments, suitable for both indoor and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and durable connections, improving the assembly and longevity of the product.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options on PCBs, accommodating various design configurations.

Maximum Seated Height: 3.6 mm

A low maximum seated height contributes to a flat profile, allowing for easy integration into compact device designs where space is a premium.

Width: 11 mm

Compact width makes it suitable for tightly packed PCB layouts, enhancing space efficiency in design.

Length: 15.9 mm

The length is optimized for high-density designs, providing a balance between function and space requirements.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for a broad range of applications, ensuring reliability in typical operating environments.

Technology: BCDMOS

The BCDMOS technology enhances performance-related features, combining power and signal handling in a single chip.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability, ensuring strong electrical connections.

Nominal Supply Voltage: 28 V

A nominal supply voltage of 28 V allows efficient operation in various applications, making it suitable for multiple device designs.

Turn-on Time: 0.1 us

Fast turn-on time improves responsiveness in applications, enhancing system performance and efficiency.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm enables denser packing of connections on PCBs, which is ideal for modern electronic devices.

Nominal Output Peak Current Limit: 6 A

A high output peak current limit allows for driving demanding loads, making it suitable for applications requiring significant power handling.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge configuration provides flexibility in controlling motors and other loads, enhancing the product's utility in various applications.

Turn-off Time: 0.1 us

Quick turn-off time minimizes response delays, ensuring precise control in fast-switching applications.

Output Current Flow Direction: SOURCE AND SINK

Bidirectional current flow capability enhances the versatility and control of the driver in a variety of circuit designs.

Technical Specifications

Peripheral Drivers STA500 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

9 V

Nominal Supply Voltage:

28 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

11 mm

Trade Compliance

STA500 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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