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STA502

STMicroelectronics

STA502 by STMicroelectronics

STA502 by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 36V and operates b/w 10V to 30V. It features thermal and under-voltage protections, making it ideal for reliable motor control applications. With a compact design, it supports high output currents up to 6A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,976

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-

-

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Vyrian

USA . 2,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,397

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-

-

-

Anansix

USA . 1,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,310

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,500 parts In-Stock

1+ parts

$8.478

100+ parts

$8.393

1k+ parts

$8.054

10k+ parts

-

1,500

$8.478

$8.393

$8.054

-

IDEA Electronic Components Group

UK . 1,165 parts In-Stock

1+ parts

$10.471

100+ parts

-

1k+ parts

$9.424

10k+ parts

-

1,165

$10.471

-

$9.424

-

MKK Technologies

India . 1,817 parts In-Stock

1+ parts

$19.691

100+ parts

-

1k+ parts

-

10k+ parts

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1,817

$19.691

-

-

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DigiPath Technology Company

USA . 1,817 parts In-Stock

1+ parts

$19.691

100+ parts

-

1k+ parts

-

10k+ parts

-

1,817

$19.691

-

-

-

Parana Technologies

USA . 1,396 parts In-Stock

1+ parts

-

100+ parts

$12.520

1k+ parts

-

10k+ parts

-

1,396

-

$12.520

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Corphita

USA . 855 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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855

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-

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A-Z Elektronik GmbH

Germany . 212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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212

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Overview

Elevate your designs with the STA502 from STMicroelectronics, a powerhouse in peripheral drivers renowned for quality and reliability. With built-in protections against thermal issues and undervoltage, this device ensures optimal performance in demanding applications. Its compact design and excellent thermal management make it perfect for various uses, from automotive to industrial systems. Experience unmatched efficiency and peace of mind with STA502—where innovation meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and longevity in various environmental conditions.

Surface Mount: YES

Facilitates easy integration into modern compact circuit designs, saving space.

Maximum Supply Voltage: 36 V

Allows compatibility with a wide range of applications, providing flexibility in design.

Package Shape: RECTANGULAR

Optimized shape for effective heat dissipation and ease of PCB layout.

Built-in Protections: THERMAL; UNDER VOLTAGE

Enhances safety and prevents damage, increasing the reliability of the device.

No. of Terminals: 36

Provides multiple connection points, ensuring robust electrical connections and functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Compact design with heat sink options allows for efficient thermal management in confined spaces.

Minimum Supply Voltage: 10 V

Offers operational flexibility for low-voltage applications while ensuring stable performance.

Maximum Operating Temperature: 70 °C

Suitable for use in a variety of environments, enhancing reliability in high-temperature conditions.

Minimum Operating Temperature: 0 °C

Enables reliable performance in cooler environments, expanding operational range.

Terminal Finish: MATTE TIN

Ensures corrosion resistance and improved solderability, enhancing overall connection integrity.

Terminal Position: DUAL

Facilitates easy PCB layout and manufacturing, promoting design versatility.

Maximum Seated Height: 3.5 mm

Compact height allows for more efficient use of PCB real estate, fitting into tighter designs.

Width: 11 mm

Narrow width aids in space-efficient designs, allowing for more components in a limited area.

Length: 15.9 mm

Compact length helps in fitting multiple peripherals in a constrained layout.

Temperature Grade: COMMERCIAL

Designed for commercial use, emphasizing reliability and performance in a wide array of applications.

Technology: BCD

BCD technology allows for higher integration and efficiency, improving overall performance.

Terminal Form: GULL WING

Gull wing terminal design supports better mechanical and thermal performance for reliable solder joints.

Nominal Supply Voltage: 30 V

Optimized voltage rating ensures efficient operation while maximizing performance.

Turn-on Time: 0.1 us

Fast turn-on time facilitates quick responses in applications, enhancing overall system performance.

Terminal Pitch: 0.65 mm

Compact terminal pitch supports modern PCB design practices for high-density assemblies.

Nominal Output Peak Current Limit: 6 A

High current capacity allows for robust performance in demanding applications.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Half bridge design provides efficient control over high-side and low-side switching, ideal for motor control.

Turn-off Time: 0.1 us

Rapid turn-off time enhances switching efficiency, reducing power loss and improving thermal management.

Output Current Flow Direction: SOURCE AND SINK

Flexibility in current flow direction makes it suitable for a variety of load configurations.

Technical Specifications

Peripheral Drivers STA502 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

30 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

11 mm

Trade Compliance

STA502 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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