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STA517B

STMicroelectronics

STA517B by STMicroelectronics

STA517B by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 56V and supports up to 8A output current. It features built-in protections against transients, thermal issues, and under-voltage. Ideal for applications requiring robust motor control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,791 parts In-Stock

1+ parts

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4,791

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Digiode

USA . 1,914 parts In-Stock

1+ parts

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1,914

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Anansix

USA . 1,362 parts In-Stock

1+ parts

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1,362

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,015 parts In-Stock

1+ parts

$8.174

100+ parts

-

1k+ parts

$7.357

10k+ parts

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2,015

$8.174

-

$7.357

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MKK Technologies

India . 96 parts In-Stock

1+ parts

$15.371

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-

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96

$15.371

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DigiPath Technology Company

USA . 96 parts In-Stock

1+ parts

$15.371

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96

$15.371

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A-Z Elektronik GmbH

Germany . 5,382 parts In-Stock

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5,382

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Corphita

USA . 4,555 parts In-Stock

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4,555

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Parana Technologies

USA . 115 parts In-Stock

1+ parts

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100+ parts

$9.774

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115

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$9.774

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Kepictronics

USA . 88 parts In-Stock

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88

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Overview

Elevate your designs with the STA517B from STMicroelectronics, a premier choice in peripheral drivers that combines exceptional quality with cutting-edge technology. With robust built-in protections and a versatile operating range, this compact driver ensures reliability for demanding applications in automotive, industrial, and consumer electronics. Trust in STMicroelectronics’ legacy of innovation to deliver efficiency and performance, unlocking unparalleled value and peace of mind for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable materials ensure longevity and stability under normal operational conditions.

Surface Mount: YES

Facilitates easier and more efficient assembly in modern manufacturing processes.

Maximum Supply Voltage: 56 V

Supports a wide voltage range, making it suitable for diverse applications.

No. of Functions: 4

Allows for multiple functionalities in one chip, optimizing space and reducing costs.

Package Shape: RECTANGULAR

Designed for easy integration into various circuit configurations.

Built-in Protections: TRANSIENT; THERMAL; UNDER VOLTAGE

Ensures safe operation and reliability by protecting against potential electrical faults.

No. of Terminals: 36

Provides ample connectivity options for versatile circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Compact size helps save space on circuit boards while maintaining efficient heat dissipation.

Minimum Supply Voltage: 10 V

Allows operation under lower voltage conditions, thereby increasing design flexibility.

Maximum Operating Temperature: 70 °C

Ensures performance in higher temperature environments, enhancing reliability.

Minimum Operating Temperature: 0 °C

Operates effectively from low temperatures, suitable for various climates and applications.

Terminal Position: DUAL

Facilitates easier connections in PCB layouts for more complex circuit configurations.

Maximum Seated Height: 3.43 mm

Low profile design helps in compact assemblies, conserving vertical space.

Width: 11 mm

Compact dimension allows for space-efficient PCB layout.

Length: 15.9 mm

Optimal length for versatile mounting while maintaining high functionality.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications with prolonged performance reliability.

Technology: BCD

Utilizes a modern technology that enhances efficiency and reduces chip size.

Terminal Form: GULL WING

Facilitates easy soldering and assembly, enhancing manufacturing efficiency.

Nominal Supply Voltage: 50 V

Provides a stable operational range, ensuring consistent performance.

Turn-on Time: 100 us

Fast response time contributes to efficient switching and overall system performance.

Terminal Pitch: 0.65 mm

Allows for high-density layouts, making it easier to fit into compact designs.

Nominal Output Peak Current Limit: 8 A

Accommodates substantial current demands, ideal for driving powerful loads.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Designed for efficient driving of motors and other peripherals, improving system integration.

Turn-off Time: 100 us

Quick turn-off characteristics contribute to reduced power loss and optimized performance.

Output Current Flow Direction: SOURCE AND SINK

Flexibility in current direction enhances compatibility with various load types.

Technical Specifications

Peripheral Drivers STA517B attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Maximum Supply Voltage:

56 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

50 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

100 us

Turn-on Time:

100 us

Width:

11 mm

Trade Compliance

STA517B Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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