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STA505A

STMicroelectronics

STA505A by STMicroelectronics

STA505A by STMicroelectronics is a half-bridge peripheral driver with 4 functions, supporting supply voltages from 10V to 40V. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for applications requiring robust performance in compact designs, it operates efficiently at up to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,529

-

-

-

-

Digiode

USA . 1,147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,147

-

-

-

-

Anansix

USA . 416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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416

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,190 parts In-Stock

1+ parts

$8.112

100+ parts

-

1k+ parts

$7.300

10k+ parts

-

2,190

$8.112

-

$7.300

-

MKK Technologies

India . 2,075 parts In-Stock

1+ parts

$15.253

100+ parts

-

1k+ parts

-

10k+ parts

-

2,075

$15.253

-

-

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DigiPath Technology Company

USA . 2,075 parts In-Stock

1+ parts

$15.253

100+ parts

-

1k+ parts

-

10k+ parts

-

2,075

$15.253

-

-

-

Parana Technologies

USA . 2,094 parts In-Stock

1+ parts

-

100+ parts

$9.699

1k+ parts

-

10k+ parts

-

2,094

-

$9.699

-

-

Metaverse IC Inc.

Canada . 1,100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,100

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-

-

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Corphita

USA . 388 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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388

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Overview

Experience unparalleled performance with the STA505A from STMicroelectronics, a leader in cutting-edge technology. This versatile peripheral driver is designed to enhance your applications, delivering robust protection against overcurrent, thermal issues, and undervoltage. With its compact design and efficient power management, the STA505A ensures reliability and efficiency across diverse industries, making it the smart choice for innovators seeking quality and value. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable design, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact designs, contributing to space-efficient PCB layouts.

No. of Functions: 4

Having multiple functions maximizes versatility, allowing integration into various devices and reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape provides easy placement on PCB and efficient use of space.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protective features enhance reliability and durability, safeguarding the device from damaging conditions.

Maximum Supply Voltage-1: 40 V

A high maximum supply voltage allows the product to be used in high-power applications.

No. of Terminals: 36

A high terminal count ensures extensive connectivity options, facilitating complex circuits and multiple functionalities.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design allows for higher density mounting on PCBs, ideal for compact applications.

Minimum Supply Voltage-1: 10 V

A low minimum supply voltage expands compatibility with various systems without the need for high-voltage supplies.

Maximum Operating Temperature: 70 °C

Operates at a higher temperature, making it suitable for environments where heat dissipation is a consideration.

Minimum Operating Temperature: 0 °C

Ability to operate from 0 °C ensures performance in a wide range of environmental conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability, leading to reliable connections and longer device lifespan.

Terminal Position: DUAL

Dual terminal positioning enhances design flexibility and simplifies routing on PCBs.

Maximum Seated Height: 3.43 mm

A low seated height promotes space savings on PCBs, beneficial for compact electronic devices.

Width: 11 mm

Narrow width contributes to overall compactness, allowing for denser layouts while using less board area.

Length: 15.7 mm

Short length optimizes PCB layout and enhances integration possibilities in systems with space constraints.

Temperature Grade: COMMERCIAL

Commercial grade components ensure good performance in general-purpose applications, balancing cost and functionality.

Technology: BCD

BCD (Bipolar-CMOS-DMOS) technology provides high efficiency and performance, making it ideal for peripheral driving applications.

Terminal Form: GULL WING

Gull wing terminals offer excellent mechanical strength and help to improve the soldering process for a robust connection.

Nominal Supply Voltage: 3.3 V

Operating at a common nominal voltage ensures compatibility with many modern digital circuits.

Turn-on Time: 0.1 us

Fast turn-on time improves responsiveness in applications requiring quick activation.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for efficient use of space on PCBs, supporting high-density designs.

Nominal Supply Voltage-1: 30 V

A separate nominal supply voltage of 30V permits flexible power management and higher loads in certain applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, ensuring appropriate handling and soldering practices.

Nominal Output Peak Current Limit: 6 A

High peak current limit accommodates demanding applications, allowing for significant power handling.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Half bridge design optimizes drive capability while minimizing the components needed, maximizing efficiency.

Turn-off Time: 0.1 us

Quick turn-off time enhances overall circuit performance and reduces delay in response times.

Output Current Flow Direction: SOURCE AND SINK

Bidirectional output current flow increases design flexibility for various operational scenarios.

Technical Specifications

Peripheral Drivers STA505A attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

40 V

Minimum Supply Voltage-1:

10 V

Nominal Supply Voltage-1:

30 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

11 mm

Trade Compliance

STA505A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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