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STA508A

STMicroelectronics

STA508A by STMicroelectronics

STA508A by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 36V and supports up to 6A output current. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for driving motors in commercial applications, it operates b/w 0 °C to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,449 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,449

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Anansix

USA . 2,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,723

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Digiode

USA . 2,664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,897 parts In-Stock

1+ parts

$12.788

100+ parts

-

1k+ parts

$11.509

10k+ parts

-

1,897

$12.788

-

$11.509

-

MKK Technologies

India . 1,627 parts In-Stock

1+ parts

$24.047

100+ parts

-

1k+ parts

-

10k+ parts

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1,627

$24.047

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DigiPath Technology Company

USA . 1,627 parts In-Stock

1+ parts

$24.047

100+ parts

-

1k+ parts

-

10k+ parts

-

1,627

$24.047

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-

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Corphita

USA . 2,756 parts In-Stock

1+ parts

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2,756

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Parana Technologies

USA . 2,218 parts In-Stock

1+ parts

-

100+ parts

$15.290

1k+ parts

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10k+ parts

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2,218

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$15.290

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Overview

Elevate your designs with STA508A from STMicroelectronics, a leading name in innovation and reliability. This robust half-bridge peripheral driver combines exceptional performance with built-in protections against overcurrent, thermal issues, and undervoltage, ensuring peace of mind in demanding applications. Perfect for automotive, industrial, and consumer electronics, the STA508A enhances efficiency while simplifying integration, making it the ideal choice for engineers seeking quality and value. Choose STA508A for unmatched performance and reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-term reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern PCB layouts.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides flexibility for various applications, adaptable to different power requirements.

No. of Functions: 4

Multiple functions enable versatility in applications, reducing the need for multiple devices and saving PCB space.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency on circuit boards, making it easier to design compact electronic devices.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protection mechanisms enhance reliability and prevent damage under fault conditions, ensuring safety in operation.

No. of Terminals: 36

A high number of terminals facilitates various connections, supporting complex circuit configurations and enabling more robust designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package with heat sink provisions helps to minimize thermal resistance, allowing for efficient heat dissipation.

Minimum Supply Voltage: 9 V

The ability to operate at a low minimum supply voltage makes the product suitable for battery-powered applications, increasing its usability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in a wide range of thermal environments.

Minimum Operating Temperature: 0 °C

The minimum temperature specification allows the device to function in cold conditions, making it suitable for outdoor and low-temperature applications.

Terminal Position: DUAL

Dual terminal positioning enhances the integrity and reliability of the connections, reducing the risk of failure.

Maximum Seated Height: 3.43 mm

A low seated height facilitates the product's integration into devices with tight space constraints, promoting design flexibility.

Width: 11 mm

A compact width allows for efficient placement on compact circuit boards, beneficial for space-critical applications.

Peak Reflow Temperature °C: 245

A relatively high peak reflow temperature supports compatibility with various soldering processes, simplifying manufacturing.

Length: 15.7 mm

Short length contributes to a reduced footprint, which is crucial for miniaturized electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates suitability for standard applications, making it versatile across consumer electronics.

Technology: BCD

BCD technology offers high efficiency and low power consumption, making it ideal for energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate soldering with straightforward mechanical connections, enhancing assembly efficiency.

Nominal Supply Voltage: 30 V

Support for a nominal supply voltage of 30 V ensures compatibility with a wide range of power supply configurations.

Turn-on Time: 0.1 us

A fast turn-on time contributes to quick response in applications, allowing for effective control in high-speed operations.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for dense packing in PCBs, a key feature for modern electronic devices.

Nominal Output Peak Current Limit: 6 A

The capability to handle up to 6 A of output peak current enhances performance in demanding applications.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge configuration provides efficient control over motors and other inductive loads, making it ideal for diverse peripheral applications.

Turn-off Time: 0.1 us

Fast turn-off times ensure better control and reduce latency in switching applications, providing improved system performance.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current opens up a range of applications, allowing for both driving and control functions in circuits.

Technical Specifications

Peripheral Drivers STA508A attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

Length:

15.7 mm

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

9 V

Nominal Supply Voltage:

30 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

11 mm

Trade Compliance

STA508A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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