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PSD813F2VA-20JI

STMicroelectronics

PSD813F2VA-20JI by STMicroelectronics

PSD813F2VA-20JI by STMicroelectronics is a versatile parallel I/O port with a max supply voltage of 3.6V and operates in industrial conditions from -40 °C to 85 °C. It features 27 I/O lines and a compact chip carrier design. Ideal for general-purpose applications requiring reliable data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,011 parts In-Stock

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3,011

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ComSIT Distribution GmbH

Germany . 2,550 parts In-Stock

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2,550

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ComSIT USA

USA . 2,550 parts In-Stock

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2,550

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Digiode

USA . 2,342 parts In-Stock

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2,342

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Anansix

USA . 1,375 parts In-Stock

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1,375

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Cyclops Electronics Ltd

UK . 870 parts In-Stock

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870

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Lantek

USA . 160 parts In-Stock

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160

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Distributors (Availability)

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AZTECH Wire

Italy . 718 parts In-Stock

1+ parts

$16.640

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-

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718

$16.640

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Microchip USA

USA . 259 parts In-Stock

1+ parts

$43.157

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259

$43.157

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Corohmni

South Africa . 1,932 parts In-Stock

1+ parts

$44.837

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1,932

$44.837

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IDEA Electronic Components Group

UK . 1,484 parts In-Stock

1+ parts

$76.440

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-

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$68.796

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1,484

$76.440

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$68.796

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MKK Technologies

India . 2,092 parts In-Stock

1+ parts

$143.741

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2,092

$143.741

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DigiPath Technology Company

USA . 2,092 parts In-Stock

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$143.741

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2,092

$143.741

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Corphita

USA . 4,986 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Parana Technologies

USA . 2,285 parts In-Stock

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$91.396

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$91.396

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RC Electronics

USA . 2,183 parts In-Stock

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2,183

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Perfect Parts

USA . 338 parts In-Stock

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338

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GreenTree Electronics

Israel . 160 parts In-Stock

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160

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Overview

Unlock the potential of your applications with the PSD813F2VA-20JI from STMicroelectronics, a leader in innovative semiconductor solutions. This reliable parallel I/O port delivers exceptional performance in demanding environments, ensuring robust operation at extreme temperatures. With its compact design and energy efficiency, it empowers engineers to create advanced, cost-effective designs for industrial automation, automotive systems, and consumer electronics. Experience quality you can trust and elevate your projects with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, catering to a variety of industrial applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and simplifies manufacturing, making it ideal for compact designs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the device maintains compatibility with various voltage levels commonly found in modern electronics.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, providing flexibility in circuit layout and design.

Power Supplies (V): 3.3

Designed to operate at a nominal supply voltage of 3.3 V, making it well-suited for low-power applications.

No. of Terminals: 52

With 52 terminals, this device offers extensive connectivity options, facilitating versatile configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal performance and facilitates easy integration into various systems.

Minimum Supply Voltage: 3 V

The capability to function at a minimum voltage of 3 V provides flexibility in power supply design.

Maximum Operating Temperature: 85 °C

An operational temperature of up to 85 °C ensures reliability in high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C makes this device suitable for harsh environments.

Ultraviolet Erasable: N

Non-erasable characteristics eliminate concerns about data loss from ultraviolet exposure, enhancing data integrity.

Terminal Position: QUAD

Quad terminal positioning optimizes signal pathways and improves electrical performance.

No. of Ports: 4

Having 4 ports allows for efficient parallel data transfer, improving overall system performance.

Maximum Seated Height: 4.57 mm

The low seated height minimizes the mounting profile, allowing for a sleeker design in compact electronic devices.

Width: 19.1 mm

A width of 19.1 mm provides a compact footprint, making it suitable for space-constrained applications.

Length: 19.1 mm

The consistent length of 19.1 mm aligns with standardized PCB layouts, simplifying the integration process.

Temperature Grade: INDUSTRIAL

Classified as industrial grade, this component is designed to withstand challenging conditions, ensuring longevity and reliability.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it provides versatile I/O capabilities suitable for various applications.

ROM Bits Size: 1310720 Bits

A substantial ROM size of 1310720 bits enables extensive data storage and enhances functionality.

Technology: CMOS

Utilizing CMOS technology results in lower power consumption and increased performance, perfect for energy-efficient designs.

Terminal Form: J BEND

J bend terminals facilitate easier soldering and enhance mechanical stability on the PCB.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V aligns with industry standards, ensuring widespread compatibility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for densely packed designs without compromising electrical performance.

Maximum Standby Current: 0.0001 Amp

An extremely low maximum standby current ensures energy efficiency, making it ideal for battery-operated devices.

Maximum Access Time: 0.0000002 ns

A remarkably fast maximum access time of 0.2 ns enhances data retrieval speed, contributing to efficient operation.

No. of I/O Lines: 27

With 27 I/O lines, this product supports a large number of data connections, making it versatile in various applications.

Technical Specifications

Parallel I/O Ports PSD813F2VA-20JI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.0000002 ns

JESD-30 Code:

S-PQCC-J52

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD813F2VA-20JI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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