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PSD813F1A-12UI

STMicroelectronics

PSD813F1A-12UI by STMicroelectronics

PSD813F1A-12UI by STMicroelectronics is a low-profile, square parallel I/O port with 64 terminals. It operates b/w -40 °C to 85 °C and supports a supply voltage of 4.5V to 5.5V. Ideal for industrial applications, it features fast access times and robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,883 parts In-Stock

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2,883

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Vyrian

USA . 1,684 parts In-Stock

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1,684

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Anansix

USA . 453 parts In-Stock

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453

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 362 parts In-Stock

1+ parts

$22.255

100+ parts

-

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362

$22.255

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IDEA Electronic Components Group

UK . 851 parts In-Stock

1+ parts

$55.043

100+ parts

-

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$49.538

10k+ parts

-

851

$55.043

-

$49.538

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Corohmni

South Africa . 250 parts In-Stock

1+ parts

$65.951

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250

$65.951

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Component Stockers USA

USA . 225 parts In-Stock

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$99.990

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225

$99.990

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MKK Technologies

India . 1,289 parts In-Stock

1+ parts

$103.504

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1,289

$103.504

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DigiPath Technology Company

USA . 1,289 parts In-Stock

1+ parts

$103.504

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1,289

$103.504

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 510 parts In-Stock

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510

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Parana Technologies

USA . 223 parts In-Stock

1+ parts

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$65.812

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223

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$65.812

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Kepictronics

USA . 86 parts In-Stock

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86

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Overview

Unlock unparalleled performance with the PSD813F1A-12UI from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability, this parallel I/O port is perfect for diverse applications ranging from industrial automation to consumer electronics. Experience robustness with its low-profile design and wide operating temperature range. Elevate your projects with superior quality and the assurance of a trusted manufacturer, ensuring longevity and efficiency for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-term reliability and protection against environmental factors, making this product suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for compact designs and simplifies manufacturing processes, which is advantageous for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V offers compatibility with various power systems, enhancing versatility in applications.

Package Shape: SQUARE

The square package shape optimizes space on printed circuit boards, allowing for efficient use of the available area.

Power Supplies (V): 5

Designed for standard 5V power supplies, this product is easily integrated into most existing systems.

No. of Terminals: 64

With 64 terminals, this product supports extensive connectivity options, facilitating complex I/O operations.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design ensures easy placement in tight spaces, which is ideal for modern, compact devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V enhances adaptability to various power conditions without compromising performance.

Maximum Operating Temperature: 85 °C

The product can operate at high temperatures, making it suitable for use in environments with significant heat generation.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, it is reliable in extreme conditions, making it ideal for outdoor and industrial applications.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing the longevity and performance of connections.

Ultraviolet Erasable: N

While not UV erasable, the EPROM technology ensures stable data retention without the need for frequent erasure, suitable for consistent applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing and connection schemes, providing flexibility in layout design.

No. of Ports: 4

Four ports enable simultaneous data handling, improving data transmission efficiency and system responsiveness.

Maximum Seated Height: 1.54 mm

The low seated height helps conserve space and contributes to the overall compactness of the circuit board design.

Width: 14 mm

The 14 mm width allows for easy integration into various designs without taking up excessive board space.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C means compatibility with standard soldering processes, ensuring a seamless assembly.

Length: 14 mm

The 14 mm length maintains a uniform size with its width, which assists in providing a compact design overall.

Temperature Grade: INDUSTRIAL

The industrial temperature grade assures reliability in harsh environments, making it suitable for demanding industrial applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, this IC can be utilized in a wide range of applications, enhancing its utility.

ROM Bits Size: 1310720 Bits

A generous ROM size ensures ample storage for firmware or configuration data, optimizing performance in various applications.

Technology: CMOS

Using CMOS technology provides low power consumption and high-speed performance, making it efficient and responsive.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering to PCB, aiding in efficient assembly and maintenance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is standard in most systems, ensuring ease of integration and widespread compatibility.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch enhances density without compromising on connection reliability, ideal for compact designs.

Maximum Standby Current: 0.0002 Amp

The minimal standby current indicates energy efficiency, which is essential for battery-operated or energy-sensitive applications.

Maximum Access Time: 0.00000012 ns

A remarkable access time ensures high-speed data transfers, improving overall system performance and responsiveness.

No. of I/O Lines: 27

With 27 I/O lines, this product can handle multiple data inputs and outputs simultaneously, catering to complex tasks and applications.

Technical Specifications

Parallel I/O Ports PSD813F1A-12UI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3/e4

Length:

14 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

1.54 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Ultraviolet Erasable:

N

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-12UI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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