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PCAL9554BBSHP

NXP Semiconductors

PCAL9554BBSHP by NXP Semiconductors

NXP Semiconductors' PCAL9554BBSHP is an 8-bit parallel I/O port with a supply voltage range of 1.65V to 5.5V, suitable for industrial applications. This CMOS technology chip carrier has a very thin profile and operates in temperatures ranging from -40°C to 85°C. With surface mount capability and quad terminal position, it offers versatile connectivity options for various electronic devices.

Median Price

$1.068

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,423 parts In-Stock

1+ parts

$0.982

100+ parts

$0.921

1k+ parts

$0.881

10k+ parts

$0.852

4,423

$0.982

$0.921

$0.881

$0.852

Arrow

USA . 545 parts In-Stock

1+ parts

$1.068

100+ parts

$1.002

1k+ parts

$0.969

10k+ parts

-

545

$1.068

$1.002

$0.969

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Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.020

10k+ parts

$0.910

6,000

-

$1.230

$1.020

$0.910

Mouser Electronics

USA . 5,926 parts In-Stock

1+ parts

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10k+ parts

$0.898

5,926

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$0.898

Verical

USA . 4,450 parts In-Stock

1+ parts

-

100+ parts

$0.921

1k+ parts

$0.852

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4,450

-

$0.921

$0.852

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Farnell

UK . 241 parts In-Stock

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$1.350

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241

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$1.350

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Element14

Singapore . 241 parts In-Stock

1+ parts

-

100+ parts

$1.379

1k+ parts

$1.073

10k+ parts

$1.006

241

-

$1.379

$1.073

$1.006

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,237 parts In-Stock

1+ parts

$0.933

100+ parts

-

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2,237

$0.933

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.200

100+ parts

-

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100

$1.200

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Flip Electronics

USA . 24,000 parts In-Stock

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Vyrian

USA . 2,059 parts In-Stock

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Anansix

USA . 819 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 8,181 parts In-Stock

1+ parts

$0.590

100+ parts

$0.590

1k+ parts

$1.020

10k+ parts

-

8,181

$0.590

$0.590

$1.020

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Semicontronic

India . 2,024 parts In-Stock

1+ parts

$0.720

100+ parts

$0.702

1k+ parts

$0.698

10k+ parts

-

2,024

$0.720

$0.702

$0.698

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Ampacity Inc.

Singapore . 1,822 parts In-Stock

1+ parts

$0.760

100+ parts

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1,822

$0.760

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Corphita

USA . 4,603 parts In-Stock

1+ parts

$0.884

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4,603

$0.884

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Argo Parts USA

USA . 447 parts In-Stock

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$1.200

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447

$1.200

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.200

100+ parts

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1k+ parts

$1.140

10k+ parts

$1.116

100

$1.200

-

$1.140

$1.116

Corohmni

South Africa . 528 parts In-Stock

1+ parts

$1.428

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528

$1.428

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Continental Prestige Electronics

USA . 953 parts In-Stock

1+ parts

$2.170

100+ parts

$1.410

1k+ parts

$0.943

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953

$2.170

$1.410

$0.943

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Microchip USA

USA . 8,017 parts In-Stock

1+ parts

$6.285

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8,017

$6.285

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Aztec Data Supply Inc.

USA . 1,079 parts In-Stock

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$15.970

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1,079

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Lixinc

USA . 17,457 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Futuretech Components

Singapore . 2,390 parts In-Stock

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UNI Independent Distributors

Spain . 1,849 parts In-Stock

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Unlock endless possibilities with the NXP Semiconductors PCAL9554BBSHP Parallel I/O Ports. This innovative product boasts superior quality and reliability from a trusted manufacturer, offering a wide range of applications in various industries. Experience seamless integration and enhanced functionality with this versatile chip carrier, heat sink, and very thin profile package style. With a maximum supply voltage of 5.5V, minimum operating temperature of -40°C, and industrial-grade durability, the PCAL9554BBSHP provides unmatched value and benefits to customers seeking high-performance parallel IO ports for their projects. Elevate your designs with NXP Semiconductors today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the product, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the product onto a circuit board, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product can handle higher power levels, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape allows for space-efficient placement on a circuit board, maximizing the use of available space and enabling a compact design.

No. of Bits: 8

Having 8 bits provides flexibility and versatility in data transmission and processing, making the product suitable for various parallel I/O operations.

Power Supplies (V): 1.8/5

Support for both 1.8 V and 5 V power supplies allows for compatibility with a wide range of systems and devices, increasing the product's versatility.

No. of Terminals: 16

With 16 terminals, this product offers multiple connection points for input and output signals, enhancing the functionality and capability of the parallel I/O port.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer options for different mounting methods and heat dissipation requirements, providing flexibility in design and application.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage of 1.65 V ensures efficient power consumption and compatibility with low-power systems, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures reliable performance in harsh environmental conditions, making the product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature tolerance (-40°C) allows the product to function effectively in extreme cold environments, increasing its usability.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections, reducing the risk of signal interference or disconnection, ensuring reliable data transmission.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for a slim and compact design, making the product suitable for space-constrained applications.

Width: 3 mm

The narrow width of 3 mm enables easy integration into tight spaces on a circuit board, maximizing the use of available board space and facilitating compact designs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures the product can withstand the soldering process during assembly, maintaining its reliability.

Length: 3 mm

The short length of 3 mm allows for a space-efficient layout on a circuit board, enabling compact designs and efficient use of available board space.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures the product can withstand harsh operating conditions in industrial environments, making it a durable and reliable choice.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

The peripheral IC type of parallel I/O port, general purpose, indicates that the product is versatile and suitable for a wide range of applications requiring parallel I/O functionality.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the product energy-efficient and suitable for high-performance parallel I/O operations.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and reduces the risk of soldering errors, ensuring reliable and secure connections for efficient parallel I/O operations.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V indicates the standard operating voltage of the product, ensuring compatibility with a wide range of systems and devices.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm allows for high-density mounting on a circuit board, enabling compact designs and efficient use of available board space.

No. of I/O Lines: 8

With 8 I/O lines, this product provides multiple input and output channels for parallel data transmission, enhancing the product's capability and versatility.

Technical Specifications

Parallel I/O Ports PCAL9554BBSHP attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Peripheral IC Type:

Trade Compliance

PCAL9554BBSHP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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