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PCAL6416AEXX

NXP Semiconductors

PCAL6416AEXX by NXP Semiconductors

NXP Semiconductors' PCAL6416AEXX is a 16-bit parallel I/O port with supply voltage range of 1.65V to 5.5V, ideal for industrial applications. It features a grid array package style with very thin profile and fine pitch, suitable for surface mount assembly. This CMOS technology-based IC offers 2 ports and 16 I/O lines in a compact square package measuring 2mm x 2mm.

Median Price

$0.629

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 17 parts In-Stock

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$0.629

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Vyrian

USA . 5,921 parts In-Stock

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Digiode

USA . 2,396 parts In-Stock

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Anansix

USA . 290 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,244 parts In-Stock

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$0.629

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$0.617

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$0.617

Argo Parts USA

USA . 623 parts In-Stock

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$0.629

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$0.611

623

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$0.611

Netroflash

USA . 50 parts In-Stock

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$0.629

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$0.598

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$0.585

50

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$0.585

Ampacity Inc.

Singapore . 1,623 parts In-Stock

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$2.000

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Semicontronic

India . 847 parts In-Stock

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$2.000

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$1.950

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$1.940

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$2.000

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AZTECH Wire

Italy . 587 parts In-Stock

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$12.217

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Microchip USA

USA . 458 parts In-Stock

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$14.585

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One Stop Electronics

USA . 842 parts In-Stock

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$19.000

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Corohmni

South Africa . 161 parts In-Stock

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$45.634

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Aztec Data Supply Inc.

USA . 5,217 parts In-Stock

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$80.890

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Perfect Parts

USA . 23,520 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 2,614 parts In-Stock

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UNI Independent Distributors

Spain . 2,595 parts In-Stock

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Vigor

Singapore . 387 parts In-Stock

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Kepictronics

USA . 40 parts In-Stock

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Overview

Elevate your electronic designs with the PCAL6416AEXX by NXP Semiconductors, a cutting-edge Parallel I/O Port that offers unmatched quality and reliability. Ideal for a wide range of applications, this innovative product boasts a sleek package design and advanced technology. With a broad temperature range and low power consumption, customers can expect exceptional performance and efficiency. Trust NXP Semiconductors to deliver top-notch solutions that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards.

No. of Bits: 16

With 16 bits, this product offers a high level of data transmission capabilities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

No. of Ports: 2

Having 2 ports allows for versatile connectivity options in different applications.

Technical Specifications

Parallel I/O Ports PCAL6416AEXX attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B24

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2 mm

Peripheral IC Type:

Trade Compliance

PCAL6416AEXX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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