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PCAL9555AHF

NXP Semiconductors

PCAL9555AHF by NXP Semiconductors

PCAL9555AHF by NXP Semiconductors is a parallel I/O port with 16 I/O lines. It operates at a supply voltage range of 1.65V to 5.5V and has an industrial temperature grade of -40°C to 85°C. This chip carrier, heat sink package is commonly used for general purpose applications requiring parallel I/O control.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 5,500 parts In-Stock

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Digiode

USA . 4,289 parts In-Stock

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Anansix

USA . 1,394 parts In-Stock

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Vyrian

USA . 720 parts In-Stock

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720

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Bristol Electronics

USA . 100 parts In-Stock

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100

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Atlantic Semiconductor

USA . 100 parts In-Stock

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Nova Conductors

Japan . 36 parts In-Stock

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One Stop Electronics

USA . 364 parts In-Stock

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AZTECH Wire

Italy . 799 parts In-Stock

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Semicontronic

India . 635 parts In-Stock

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$15.600

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$15.520

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Ampacity Inc.

Singapore . 1,507 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,162 parts In-Stock

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Corohmni

South Africa . 660 parts In-Stock

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Kepictronics

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UNI Independent Distributors

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Lixinc

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the PCAL9555AHF by NXP Semiconductors, the ultimate solution for all your parallel I/O port needs. With its cutting-edge technology and high-quality manufacturing by NXP Semiconductors, this product guarantees exceptional performance and reliability. Whether you're in industrial automation, consumer electronics, or automotive applications, the PCAL9555AHF offers immense value and benefits. Experience seamless integration, maximum supply voltage of 5.5V, and a wide operating temperature range from -40°C to 85°C. Say goodbye to technical glitches and hello to efficient and effortless operations with the PCAL9555AHF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability enables easy and efficient integration of the product onto circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for different power requirements.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards.

No. of Terminals: 24

Provides ample connectivity options for versatile usage scenarios.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal performance and space-saving benefits.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage allows for energy-efficient operation and compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range support enables the product to function effectively in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-term reliability.

No. of Ports: 2

Two ports offer increased connectivity options and flexibility in data transfer.

Maximum Seated Height: 0.8 mm

Low seated height allows for a compact and space-saving design on circuit boards.

Width: 4 mm

Compact width dimension helps in fitting the product in tight spaces for efficient board layout.

Length: 4 mm

Short length dimension makes the product suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port design offers versatility for a wide range of applications and devices.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation for efficient data transfer.

Terminal Form: NO LEAD

Lead-free terminal form meets environmental regulations and ensures compatibility with modern manufacturing processes.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent performance and compatibility with various systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on circuit boards, maximizing connectivity in limited space.

No. of I/O Lines: 16

Sixteen I/O lines provide sufficient input and output options for data transfer and communication.

Technical Specifications

Parallel I/O Ports PCAL9555AHF attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PCAL9555AHF Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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