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PCF8575TS/F1,112

NXP Semiconductors

PCF8575TS/F1,112 by NXP Semiconductors

NXP Semiconductors' PCF8575TS/F1,112 is a CMOS technology-based Parallel I/O Port with 16 I/O lines. It operates b/w -40 to 85 °C and supports a supply voltage range of 2.5V to 5.5V. Ideal for industrial applications requiring dual port functionality in a compact package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,819 parts In-Stock

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Vyrian

USA . 202 parts In-Stock

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Anansix

USA . 169 parts In-Stock

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169

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Ampacity Inc.

Singapore . 281 parts In-Stock

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$9.000

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$9.000

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AZTECH Wire

Italy . 551 parts In-Stock

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$18.839

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Semicontronic

India . 1,451 parts In-Stock

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$20.000

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$19.500

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$19.400

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One Stop Electronics

USA . 715 parts In-Stock

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$32.000

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715

$32.000

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Corohmni

South Africa . 128 parts In-Stock

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$32.657

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Aztec Data Supply Inc.

USA . 3,057 parts In-Stock

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$59.850

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$59.850

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UNI Independent Distributors

Spain . 8,133 parts In-Stock

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Corphita

USA . 3,635 parts In-Stock

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Argo Parts USA

USA . 3,260 parts In-Stock

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Continental Prestige Electronics

USA . 2,436 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Elevate your electronic projects with the NXP Semiconductors PCF8575TS/F1,112 Parallel I/O Ports. Designed with top-notch quality and precision by NXP Semiconductors, this versatile component offers endless possibilities for automation and control applications. With its compact design and wide operating temperature range, this product ensures reliability and durability in any environment. Experience seamless integration and enhanced performance with the PCF8575TS/F1,112 - the perfect solution for your next project. Unlock the potential of your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability of the product, making it suitable for various industrial applications.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of systems and applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on circuit boards, aiding in efficient design and layout.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting the product to external devices and peripherals, enhancing functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in data transmission.

Technical Specifications

Parallel I/O Ports PCF8575TS/F1,112 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PCF8575TS/F1,112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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