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PCA6416AHF

NXP Semiconductors

PCA6416AHF by NXP Semiconductors

PCA6416AHF by NXP Semiconductors is a Parallel I/O Port IC with 16 I/O lines, operating at 1.65-5.5V. It features a compact square package style, suitable for industrial applications requiring general-purpose parallel IO functionality in a small form factor. The chip carrier design with nickel palladium gold finish offers reliability and durability for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,841 parts In-Stock

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1,841

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Anansix

USA . 1,611 parts In-Stock

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1,611

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Digiode

USA . 1,436 parts In-Stock

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1,436

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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AZTECH Wire

Italy . 357 parts In-Stock

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$14.028

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357

$14.028

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Semicontronic

India . 1,466 parts In-Stock

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$22.000

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$21.450

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$21.340

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$22.000

$21.450

$21.340

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Ampacity Inc.

Singapore . 1,489 parts In-Stock

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$31.000

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$31.000

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One Stop Electronics

USA . 360 parts In-Stock

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$31.000

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$31.000

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Aztec Data Supply Inc.

USA . 1,722 parts In-Stock

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$66.830

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Corohmni

South Africa . 2,535 parts In-Stock

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$74.841

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$74.841

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Lixinc

USA . 15,079 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,865 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 1,396 parts In-Stock

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Argo Parts USA

USA . 1,117 parts In-Stock

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UNI Independent Distributors

Spain . 255 parts In-Stock

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255

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock limitless possibilities with the PCA6416AHF by NXP Semiconductors, a leading manufacturer known for its superior quality and innovative technology. This Parallel I/O Ports device offers unparalleled flexibility and efficiency in various applications. With a wide operating voltage range and industrial-grade temperature grade, this product ensures reliable performance even in demanding conditions. Experience seamless integration and enhanced functionality with the PCA6416AHF, making it the ideal choice for your next project. Elevate your designs with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product.

Surface Mount: YES

Enables easy and secure mounting of the product on a circuit board, saving space and facilitating assembly.

Maximum Supply Voltage: 5.5 V

Allows compatibility with a wide range of systems and applications.

Package Shape: SQUARE

Easily fits into standard PCB layouts and allows for efficient use of space.

No. of Terminals: 24

Provides ample connectivity options for various devices and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers a compact form factor with efficient heat dissipation capabilities for reliable performance.

Minimum Supply Voltage: 1.65 V

Allows the product to operate efficiently even at low power supply levels.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ensures the product can function in extreme cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Allows for easy identification and organization of terminals for efficient wiring.

No. of Ports: 2

Offers multiple ports for connecting to different devices simultaneously.

Maximum Seated Height: 0.8 mm

Low profile design helps in creating compact electronic devices.

Width: 4 mm

Compact width dimensions allow for space-saving integration into circuit boards.

Length: 4 mm

Optimal length for fitting into standard PCB layouts.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments where temperature fluctuations are common.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile IC type that can be used for various applications requiring parallel I/O ports.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness and compliance with regulations.

Nominal Supply Voltage: 1.8 V

Optimal supply voltage for efficient and stable operation of the product.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density integration and precise connections.

No. of I/O Lines: 16

Sufficient I/O lines for connecting to multiple devices and peripherals for data transfer.

Technical Specifications

Parallel I/O Ports PCA6416AHF attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PCA6416AHF Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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