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PCA6416AEV

NXP Semiconductors

PCA6416AEV by NXP Semiconductors

PCA6416AEV by NXP Semiconductors is a Parallel I/O Port IC with 16 I/O lines, operating voltage range of 1.65-5.5 V, and industrial temperature grade (-40 to 85 °C). It features a grid array package style with very thin profile and fine pitch, suitable for general purpose parallel IO port applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Flip Electronics

USA . 5,420 parts In-Stock

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Digiode

USA . 4,794 parts In-Stock

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Anansix

USA . 2,074 parts In-Stock

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Vyrian

USA . 486 parts In-Stock

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Nova Conductors

Japan . 68 parts In-Stock

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AZTECH Wire

Italy . 486 parts In-Stock

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$7.277

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Ampacity Inc.

Singapore . 1,548 parts In-Stock

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$22.000

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Aztec Data Supply Inc.

USA . 3,772 parts In-Stock

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$32.296

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One Stop Electronics

USA . 987 parts In-Stock

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$35.000

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Corohmni

South Africa . 5,172 parts In-Stock

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Lixinc

USA . 8,638 parts In-Stock

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Continental Prestige Electronics

USA . 4,293 parts In-Stock

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Argo Parts USA

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UNI Independent Distributors

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Aranea Global

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Corphita

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Overview

Unlock endless possibilities with the PCA6416AEV by NXP Semiconductors, a game-changing Parallel I/O Port that boasts top-notch quality and performance. As a trusted leader in semiconductor technology, NXP delivers innovative solutions that cater to a wide range of applications. This versatile product offers customers valuable benefits and advantages, making it the perfect choice for your next project. Experience seamless integration, optimal functionality, and unmatched reliability with the PCA6416AEV. Elevate your designs with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to damage, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, saving space on the PCB.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, providing flexibility in different system configurations.

Package Shape: SQUARE

Square shape is commonly used and easy to integrate into board layouts.

No. of Terminals: 24

Sufficient number of terminals for connecting multiple devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style offers high density of terminals in a small footprint, ideal for space-constrained applications.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage allows for operation in power-sensitive applications.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures functionality in various conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly process.

No. of Ports: 2

Multiple ports allow for versatile connectivity options.

Maximum Seated Height: 1 mm

Low seated height minimizes space requirements and reduces overall system profile.

Width: 3 mm

Compact width size enables efficient use of board space.

Length: 3 mm

Short length size contributes to the overall compactness of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port allows for versatile interfacing with different devices and peripherals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: BALL

Ball terminal form provides secure connections and simplifies soldering process.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent performance in various operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and efficient use of board space.

No. of I/O Lines: 16

Sufficient number of I/O lines for versatile connectivity and data exchange with external devices.

Technical Specifications

Parallel I/O Ports PCA6416AEV attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B24

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3 mm

Peripheral IC Type:

Trade Compliance

PCA6416AEV Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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